公开(公告)号：US12046625B2

公开(公告)日：2024-07-23

申请号：US17265799

申请日：2019-01-14

Applicant: Samsung Display Co., Ltd.

Inventor： Jung Hong Min ,  Dae Hyun Kim ,  Hyun Min Cho ,  Dong Uk Kim ,  Dong Eon Lee ,  Seung A Lee ,  Hyung Rae Cha

IPC: H01L33/12 ,  H01L27/15 ,  H01L33/00 ,  H01L33/22 ,  H01L33/38 ,  H01L33/40

CPC classification number: H01L27/156 ,  H01L33/0095 ,  H01L33/12 ,  H01L33/22 ,  H01L33/38 ,  H01L33/40

Abstract: Provided are a light-emitting element, a manufacturing method thereof, and a display device comprising the light-emitting element. The method for manufacturing the light-emitting element comprises the steps of: preparing a lower substrate including a substrate and a buffer material layer formed on the substrate, forming a separating layer disposed on the lower substrate and including at least one graphene layer, forming an element deposition structure by depositing a first conductivity type semiconductor layer, an active material layer, and a second conductivity type semiconductor layer on the separating layer, forming an element rod by etching the element deposition structure and the separating layer in a vertical direction; and separating the element rod from the lower substrate to form a light emitting element.

公开(公告)号：US11949045B2

公开(公告)日：2024-04-02

申请号：US17290682

申请日：2019-05-27

Applicant: Samsung Display Co., Ltd.

Inventor： Hyun Min Cho ,  Jung Hong Min ,  Dae Hyun Kim ,  Dong Uk Kim ,  Jae Hoon Jung

IPC: H01L33/44 ,  H01L27/15 ,  H01L33/00 ,  H01L33/24

CPC classification number: H01L33/44 ,  H01L27/156 ,  H01L33/0093 ,  H01L33/24 ,  H01L2933/0025

Abstract: Provided are a light-emitting diode structure and a light-emitting diode manufacturing method. The light-emitting diode manufacturing method comprises the operations of:



preparing a lower substrate, which includes a substrate and a separation layer formed on the substrate, and preparing at least one semiconductor rod, which is formed on the separation layer, forming a rod structure, which includes a rod protecting layer formed on the separation layer to surround the at least one semiconductor rod and an auxiliary layer formed on at least part of the rod protecting layer and separating the rod structure from the lower substrate by removing the separation layer, and separating the at least one semiconductor rod from the rod structure.

公开(公告)号：US11004892B2

公开(公告)日：2021-05-11

申请号：US16275794

申请日：2019-02-14

Applicant: Samsung Display Co., Ltd.

Inventor： Dong Uk Kim ,  Hyun Min Cho ,  Keun Kyu Song ,  Dae Hyun Kim ,  Jung Hong Min ,  Seung A Lee ,  Hyung Rae Cha

IPC: H01L27/15 ,  H01L33/50 ,  H01L33/60

Abstract: A display device includes a first pixel and a second pixel; a light emitting layer; a color conversion layer on the light emitting layer; and a color filter layer on the color conversion layer, the light emitting layer including one or more light emitting elements in the first pixel and the second pixel, the color conversion layer including a first color conversion layer in the first pixel and a second color conversion layer in the second pixel. The color filter layer includes a first color filter layer in the first pixel and a second color filter layer in the second pixel, the light emitting elements capable of emitting a first light having a first wavelength, each of the first color conversion layer and the second color conversion layer including first color conversion particles and second color conversion particles.

公开(公告)号：US10862000B2

公开(公告)日：2020-12-08

申请号：US16274109

申请日：2019-02-12

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jung Hong Min ,  Dae Hyun Kim ,  Seung A Lee ,  Hyun Min Cho ,  Jong Hyuk Kang ,  Dong Uk Kim ,  Hyun Deok Im ,  Hyung Rae Cha

IPC: H01L33/00 ,  H01L27/15 ,  H01L33/32 ,  H01L21/302

Abstract: A light emitting element, a method of manufacturing a light emitting element, and a display device including a light emitting element are provided. A method of manufacturing a light emitting element includes: preparing a lower panel including a substrate and a first sub conductive semiconductor layer on the substrate; forming a first mask layer including at least one mask pattern on at least a part of the lower panel to be spaced apart from each other and an opening region in which the mask patterns are spaced apart from each other; laminating a first conductive semiconductor layer, an active material layer, and a second conductive semiconductor layer on the first mask layer to form an element laminate; etching the element laminate in a vertical direction to form an element rod; and removing the mask pattern to separate the element rod from the lower panel.