公开(公告)号：US20140097429A1

公开(公告)日：2014-04-10

申请号：US13747863

申请日：2013-01-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Dong-Ho Kim ,  Sung-Un Park

IPC: H01L33/52 ,  H01L27/15

CPC classification number: H01L33/52 ,  H01L27/1262 ,  H01L27/15

Abstract: In an aspect, an array substrate for a flexible display device and a method of manufacturing the array substrate, the method including operations of arranging at least one lower protective film on which a plurality of display units that are covered by thin-film encapsulation (TFE) units are arrayed; performing half cutting and full cutting on the at least one lower protective film; and completing the manufacture of each of the plurality of display units by removing remaining parts on the at least one lower protective film from the half cutting and full cutting is provided.

Abstract translation: 在一方面，一种柔性显示装置用阵列基板和阵列基板的制造方法，其特征在于，包括：将至少一个下保护膜配置在其上的多个由薄膜封装覆盖的显示单元（TFE） ）单位排列; 在所述至少一个下保护膜上进行半切割和全切割; 并且通过从半切割和全切割中去除至少一个下保护膜上的剩余部分来完成多个显示单元中的每一个的制造。