公开(公告)号：US11947202B2

公开(公告)日：2024-04-02

申请号：US18295121

申请日：2023-04-03

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Sébastien Cremer ,  Frédéric Boeuf ,  Stephane Monfray

IPC: G02F1/01 ,  G02B6/12 ,  G02F1/035

CPC classification number: G02F1/035 ,  G02B6/12004 ,  G02F1/0147 ,  G02F2201/063

Abstract: The present disclosure relates to a method including the following steps: a) forming a waveguide from a first material, the waveguide being configured to guide an optical signal; b) forming a layer made of a second material that is electrically conductive and transparent to a wavelength of the optical signal, steps a) and b) being implemented such that the layer made of the second material is in contact with at least one of the faces of the waveguide, or is separated from the at least one of the faces by a distance of less than half, preferably less than a quarter, of the wavelength of the optical signal. The application further relates to a phase modulator, in particular obtained by such a method.

公开(公告)号：US20170371099A1

公开(公告)日：2017-12-28

申请号：US15699707

申请日：2017-09-08

Applicant: STMicroelectronics SA ,  STMicroelectronics (Crolles 2) SAS

Inventor： Alain Chantre ,  Sébastien Cremer

IPC: G02B6/12 ,  H01S5/026 ,  H01S5/10 ,  H01S5/042 ,  H01S5/02 ,  H01S5/343

CPC classification number: G02B6/12002 ,  G02B6/12004 ,  H01S5/021 ,  H01S5/026 ,  H01S5/0262 ,  H01S5/0422 ,  H01S5/1032 ,  H01S5/34306 ,  H01S2301/176

Abstract: A photonic integrated circuit may include a silicon layer including a waveguide and at least one other photonic component. The photonic integrated circuit may also include a first insulating region arranged above a first side of the silicon layer and encapsulating at least one metallization level, a second insulating region arranged above a second side of the silicon layer and encapsulating at least one gain medium of a laser source optically coupled to the waveguide.