公开(公告)号：US20190273321A1

公开(公告)日：2019-09-05

申请号：US15993243

申请日：2018-05-30

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Han-Hung Chen ,  Chun-Yi Huang ,  Chang-Fu Lin ,  Rung-Jeng Lin ,  Kuo-Hua Yu

IPC: H01Q9/04 ,  H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K3/36 ,  H01Q1/22

Abstract: An electronic package and a method for fabricating the same are provided. A resist layer and a support are formed on a first substrate having a first antenna installation area. A second substrate having a second antenna installation area is laminated on the resist layer and the support. The resist layer is then removed. The support keeps the first substrate apart from the second substrate at a distance to ensure that the antenna transmission between the first antenna installation area and the second antenna installation area can function normally.

公开(公告)号：US20180288886A1

公开(公告)日：2018-10-04

申请号：US15865999

申请日：2018-01-09

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Han-Hung Chen ,  Yuan-Hung Hsu ,  Chang-Fu Lin ,  Rung-Jeng Lin ,  Fu-Tang Huang

IPC: H05K3/46 ,  H01L21/02 ,  H01L23/498 ,  H01L21/56 ,  H05K1/18 ,  H05K3/34

Abstract: The present disclosure provides a package stack structure and a method for manufacturing the same. The method is characterized by stacking coreless circuit portions on the board of an electronic component to reduce the overall thickness of the package stack structure.