公开(公告)号：US11430772B2

公开(公告)日：2022-08-30

申请号：US17205659

申请日：2021-03-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunsoo Chung ,  Taewon Yoo ,  Myungkee Chung

IPC: H01L25/10 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00

Abstract: A semiconductor package includes a bottom package and an upper redistribution layer disposed on the bottom package. The bottom package includes a substrate and a semiconductor chip disposed on the substrate. A conductive pillar extends upwardly from the substrate and is spaced apart from the semiconductor chip. A mold layer is disposed on the substrate and encloses the semiconductor chip and lateral side surfaces of the conductive pillar. The conductive pillar includes a connection pillar configured to electrically connect the substrate to the upper redistribution layer and an alignment pillar that is spaced apart from the connection pillar. The upper redistribution layer includes a redistribution metal pattern configured to be electrically connected to the connection pillar. A first insulating layer is in direct contact with a top surface of the redistribution metal pattern. A top surface of the alignment pillar is in direct contact with the first insulating layer.

公开(公告)号：US20220230977A1

公开(公告)日：2022-07-21

申请号：US17715479

申请日：2022-04-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunsoo Chung ,  Taewon Yoo ,  Myungkee Chung

IPC: H01L23/00

Abstract: A semiconductor package includes a chip including a pad; a first insulation pattern on the chip and exposing the pad; a redistribution layer (RDL) on an upper surface of the first insulation pattern and connected to the pad; a second insulation pattern on the upper surface of the first insulation pattern and including an opening exposing a ball land of the RDL and a patterned portion in the opening; an under bump metal (UBM) on upper surfaces of the second insulation pattern and patterned portion and filling the opening, the UBM including a first locking hole exposing an edge of an upper surface of the ball land; and a conductive ball on an upper surface of the UBM and including a first locking portion in the first locking hole. The first locking hole may be about 10% to about 50% of the area of the UBM upper surface.