公开(公告)号：US20220406623A1

公开(公告)日：2022-12-22

申请号：US17590263

申请日：2022-02-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SANGJINE PARK ,  JIHOON JEONG ,  YOUNG-HOO KIM ,  KUNTACK LEE

IPC: H01L21/67 ,  H01L21/02

Abstract: A wafer drying apparatus is disclosed. The wafer drying apparatus may include a drying chamber housing providing a drying space, in which a wafer is disposed, a supercritical fluid supplying part configured to supply a supercritical fluid into the drying space, a wafer heating part configured to heat the wafer disposed in the drying space, and a wafer cooling part configured to cool the wafer disposed in the drying space. The wafer cooling part may include a cooling plate disposed below a place, on which the wafer is loaded, and a cooling conduit inserted in the cooling plate.