公开(公告)号：US20150146888A1

公开(公告)日：2015-05-28

申请号：US14171354

申请日：2014-02-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sun Ho KIM

IPC: H04R17/02

CPC classification number: H04R19/005 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/15151 ,  H04R19/04 ,  H04R31/00 ,  H01L2924/00014

Abstract: There is provided a micro electro mechanical system (MEMS) microphone package including: an MEMS microphone chip having an internal space formed therein; a substrate having the MEMS microphone chip mounted thereon; an ASIC chip disposed in the internal space formed within the MEMS microphone chip; and a case bonded to the substrate and having an internal space formed therein in order to accommodate the MEMS microphone chip.

Abstract translation: 提供了一种微机电系统（MEMS）麦克风包，其包括：MEMS麦克风芯片，其中形成有内部空间; 具有安装在其上的MEMS麦克风芯片的基板; 设置在MEMS麦克风芯片内形成的内部空间中的ASIC芯片; 以及结合到基板并且在其中形成有内部空间以便容纳MEMS麦克风芯片的外壳。