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公开(公告)号:US20210129261A1
公开(公告)日:2021-05-06
申请号:US16668193
申请日:2019-10-30
Applicant: Raytheon Company
Inventor: Travis L. Mayberry , Craig H. McCordic , Joseph R. Ellsworth
Abstract: A method of forming a cooling structure for a heat-dissipating surface includes arranging a heat spreader layer adjacent the heat-dissipating surface, bonding a coldplate directly to the heat spreader layer opposite the heat-dissipating surface, and forming an intermetallic bond between the heat spreader layer and the coldplate. The coldplate is bonded to the heat spreader layer using ultrasonic additive manufacturing.
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公开(公告)号:US10791654B2
公开(公告)日:2020-09-29
申请号:US16038073
申请日:2018-07-17
Applicant: Raytheon Company
Inventor: Craig H. McCordic , Joseph R. Ellsworth , Todd Southard , Douglas Moriondo
Abstract: A coolant interface includes a line replaceable unit (LRU) inserted into a slot within a modular assembly such as a chassis for an electronics assembly. Quick disconnect fluid coupling fittings on the LRU mate with counterpart fittings on a fluid distribution manifold within the chassis when the LRU is inserted into the slot. A seal surrounding the quick disconnect fluid coupling fittings on a flat surface abutting a counterpart surface on the fluid distribution manifold when the LRU is inserted into the slot compresses the seal against the counterpart surface. Alignment pin(s) projecting from the flat surface and received by corresponding guide holes within the counterpart surface, and captive hardware provides pressure between the flat surface and the counterpart surface to increase and maintain compression of the seal. The alignment pins and captive hardware are arranged to increase mechanical stability of the connection.
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