公开(公告)号：US09999157B2

公开(公告)日：2018-06-12

申请号：US15236070

申请日：2016-08-12

Applicant: QUALCOMM Incorporated

Inventor： Victor Chiriac ,  Jorge Rosales ,  Jon Anderson ,  Stephen Molloy

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/367 ,  H01L23/427 ,  H01L21/48

CPC classification number: H05K7/20309 ,  F28D15/0233 ,  F28D15/0275 ,  F28D15/0283 ,  G06F1/20 ,  G06F1/203 ,  G06F2200/201 ,  H01L21/4882 ,  H01L23/3675 ,  H01L23/427 ,  H05K7/20318

Abstract: A device that includes a region comprising an integrated device and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a first condenser configured to condense the fluid, where the first condenser is located in a first wall of the device, an evaporation portion coupled to the evaporator and the first condenser, and a collection portion coupled to the first condenser and the evaporator. The evaporation portion is configured to channel an evaporated fluid from the evaporator to the first condenser. The collection portion is configured to channel a condensed fluid from the first condenser to the evaporator through the help of gravity.