公开(公告)号：US20170091138A1

公开(公告)日：2017-03-30

申请号：US14870025

申请日：2015-09-30

Applicant: Mediatek Inc.

Inventor： Liang-Yen Wang

IPC: G06F13/42 ,  G06F13/40

CPC classification number: G06F13/4282 ,  G06F13/4068

Abstract: A circuit module includes a physical layer, a first MAC layer, a second MAC layer and a multiplexer, where the physical layer is arranged to communicate with another device via a plurality of lanes, each lane represents a set of differential signal pairs, one pair for transmission and one pair for reception, and the multiplexer is coupled between the first MAC layer, the second MAC layer and the physical layer. In addition, the first MAC layer is coupled to a first group of the lanes via the physical layer, and selectively coupled to a second group of the lanes via the multiplexer and the physical layer; and the second MAC layer is selectively coupled to the second group of the lanes via the multiplexer and the physical layer.