公开(公告)号：US20220359257A1

公开(公告)日：2022-11-10

申请号：US17620533

申请日：2019-07-02

Applicant: LG ELECTRONICS INC.

Inventor： Donghae OH ,  Changseo PARK ,  Jin Hyung LEE ,  Changhyun JEONG

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/62

Abstract: Discussed is an assembly substrate used in a display manufacturing method for placing semiconductor light-emitting devices to predetermined positions thereof using an electric field and a magnetic field, the assembly substrate including a base part; a plurality of assembly electrodes extending in one direction and disposed in parallel on the base part; a dielectric layer disposed on the base part to cover the plurality of assembly electrodes; and partition walls disposed on the dielectric layer and defining cells at predetermined intervals along the one direction of the plurality of assembly electrodes so as to overlap portions of the plurality of assembly electrodes, and the semiconductor light-emitting devices being placed into the cells, respectively, wherein a protrusion part protrudes inward from at least one of inner surfaces of each of the cells.

公开(公告)号：US20220351992A1

公开(公告)日：2022-11-03

申请号：US17620432

申请日：2019-06-24

Applicant: LG ELECTRONICS INC.

Inventor： Kisu KIM ,  Changseo PARK ,  Philwon YOON

IPC: H01L21/67 ,  H01L21/683 ,  H01L25/075

Abstract: Discussed in an assembly substrate used in a display manufacturing method for placing semiconductor light-emitting devices to predetermined positions thereof using an electric field and a magnetic field, the assembly substrate including: a base part; a plurality of pair electrodes extending in one direction and disposed in parallel on the base part; a dielectric layer disposed on the base part to cover the plurality of pair electrodes; and partition walls disposed on the dielectric layer and defining cells at predetermined intervals along the one direction of the plurality of pair electrodes so as to overlap portions of the plurality of pair electrodes, and the semiconductor light-emitting devices being placed into the cells, respectively, wherein at least one of a recess portion and a concave and convex portion is formed on an upper surface of each of the partition walls.

公开(公告)号：US20220115361A1

公开(公告)日：2022-04-14

申请号：US17558309

申请日：2021-12-21

Applicant: LG ELECTRONICS INC.

Inventor： Juchan CHOI ,  Changseo PARK ,  Bongchu SHIM ,  Kiseong JEON

IPC: H01L25/075 ,  H01L25/16

Abstract: Discussed is a display device, including a substrate having an assembly region and a non-assembly region, semiconductor light emitting devices arranged on the substrate, a first wiring electrode and a second wiring electrode extended from each of the semiconductor light emitting devices, respectively, to supply an electric signal to the semiconductor light emitting devices, pair electrodes arranged on the substrate to generate an electric field when an electric current is supplied, and provided with first and second pair electrodes disposed on an opposite side to the first and second wiring electrodes with respect to the semiconductor light emitting devices, a dielectric layer disposed on the pair electrodes, and bus electrodes electrically connected to the pair electrodes, wherein the pair electrodes are arranged in parallel to each other along a direction in the assembly region, and wherein the bus electrodes are disposed in the non-assembly region.

公开(公告)号：US20220077122A1

公开(公告)日：2022-03-10

申请号：US17530155

申请日：2021-11-18

Applicant: LG ELECTRONICS INC.

Inventor： Changseo PARK ,  Jinhyung LEE ,  Jungsub KIM ,  Seongmin MOON ,  Younho HEO

IPC: H01L25/075 ,  H01L33/00 ,  H01L21/683 ,  H01L33/62

Abstract: Discussed is an assembly substrate used for a display device manufacturing method of mounting semiconductor light-emitting diodes on the assembly substrate at preset positions using electric field and magnetic field. The assembly substrate includes a base portion, a plurality of assembly electrodes on the base portion, a dielectric layer on the base portion to cover the assembly electrodes, a barrier wall on the base portion, and a metal shielding layer on the base portion, wherein the metal shielding layer overlaps the barrier wall.

公开(公告)号：US20200235077A1

公开(公告)日：2020-07-23

申请号：US16482971

申请日：2017-04-25

Applicant: LG ELECTRONICS INC.

Inventor： Kiseong JEON ,  Jinhong PARK ,  Changseo PARK ,  Hwankuk YUH

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/20 ,  H01L33/38 ,  H01L33/44 ,  H01L21/66

Abstract: The present invention relates to a display device and, more particularly, to a display device using a semiconductor light emitting element. The display device according to the present invention comprises: a substrate including a plurality of metal pads; and a green semiconductor light emitting element and a blue semiconductor light emitting element, which are electrically connected to the metal pads through self-assembly, wherein the green semiconductor light emitting element and the blue semiconductor light emitting element include identification to parts having different shapes so as to be distinguishable from each other when connected to the substrate.

公开(公告)号：US20190326477A1

公开(公告)日：2019-10-24

申请号：US16415583

申请日：2019-05-17

Applicant: LG ELECTRONICS INC.

Inventor： Junghoon KIM ,  Changseo PARK ,  Bongchu SHIM ,  Byoungkwon CHO ,  Hyunwoo CHO

IPC: H01L33/38 ,  H01L33/20 ,  H01L33/40 ,  H01L33/62 ,  H01L33/44 ,  H01L25/075 ,  H01L33/00

Abstract: The present disclosure relates a display device including a semiconductor light emitting device, and a substrate having a receiving groove in which the semiconductor light emitting device is accommodated, wherein the semiconductor light emitting device includes a first conductive semiconductor layer, a second conductive semiconductor layer disposed at an upper portion of the first conductive semiconductor layer, a first conductive electrode disposed on the first conductive semiconductor layer, and a second conductive electrode disposed on the second conductive semiconductor layer, and spaced apart from the first conductive electrode along a horizontal direction, wherein when the semiconductor light emitting device is assembled into the receiving groove, the first conductive semiconductor layer has an asymmetrical shape with respect to at least one direction so that the first conductive electrode and the second conductive electrode are arranged at preset positions.

公开(公告)号：US20190245101A1

公开(公告)日：2019-08-08

申请号：US16388491

申请日：2019-04-18

Applicant: LG ELECTRONICS INC.

Inventor： Jungmin HA ,  Youngho CHOE ,  Changseo PARK

IPC: H01L31/0224 ,  H01L31/0236 ,  H01L31/0216 ,  H01L31/068

CPC classification number: H01L31/022441 ,  H01L31/02168 ,  H01L31/02363 ,  H01L31/0684 ,  Y02E10/547

Abstract: A bifacial solar cell includes a substrate formed of a silicon wafer having an n-type conductivity; an emitter region positioned on a front surface of the substrate and having a p-type conductivity; a front negative fixed charge layer on the emitter region, and a front positive fixed charge layer on the front negative fixed charge; a plurality of first front electrodes extending in a first direction and connected to the emitter region through the front negative fixed charge layer and the front positive fixed charge layer; a plurality of second front electrodes extending in a second direction crossing the first direction and electrically and physically connected to the plurality of first front electrodes; a back aluminum oxide layer and a back silicon nitride layer on a back surface of the substrate; a plurality of back surface field regions extending in the first direction and locally positioned on the back surface of the substrate; a plurality of first back electrodes extending in the first direction and directly positioned on the plurality of back surface field regions through the back aluminum oxide layer and the back silicon nitride layer; and a plurality of second back electrodes extending in the second direction and electrically and physically connected to the plurality of first back electrodes, wherein the front negative fixed charge layer and the back aluminum oxide layer have the same thickness.

公开(公告)号：US20150255642A1

公开(公告)日：2015-09-10

申请号：US14716539

申请日：2015-05-19

Applicant: LG ELECTRONICS INC.

Inventor： Jinsung KIM ,  Chulchae CHOI ,  Changseo PARK ,  Jaewon CHANG ,  Hyungseok KIM ,  Youngho CHOE ,  Philwon Yoon

IPC: H01L31/0236 ,  H01L31/0224 ,  H01L31/0216

CPC classification number: H01L31/02366 ,  H01L31/02168 ,  H01L31/022433 ,  H01L31/0236 ,  H01L31/02363 ,  H01L31/03529 ,  H01L31/068 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

Abstract: The present invention relates to a solar cell. The solar cell includes a substrate of a first conductive type, the substrate having a textured surface on which a plurality of projected portions are formed, and surfaces of the projected portions having at least one of a plurality of particles attached thereto and a plurality of depressions formed thereon; an emitter layer of a second conductive type opposite the first conductive type, the emitter layer being positioned in the substrate so that the emitter layer has the textured surface; an anti-reflection layer positioned on the emitter layer which has the textured surface and including at least one layer; a plurality of first electrodes electrically connected to the emitter layer; and at least one second electrode electrically connected to the substrate.

Abstract translation: 本发明涉及一种太阳能电池。 太阳能电池包括第一导电类型的基板，该基板具有纹理表面，多个凸起部分形成在其上，并且突出部分的表面具有附着到其上的多个颗粒中的至少一个和多个凹陷部分 在其上形成; 与第一导电类型相反的第二导电类型的发射极层，发射极层位于衬底中，使得发射极层具有纹理表面; 位于发射极层上的防反射层，其具有纹理表面并且包括至少一个层; 电连接到发射极层的多个第一电极; 以及至少一个第二电极，其电连接到所述衬底。

公开(公告)号：US20140099747A1

公开(公告)日：2014-04-10

申请号：US14041907

申请日：2013-12-18

Applicant: LG ELECTRONICS INC.

Inventor： Yoonsil JIN ,  Goohwan SHIM ,  Youngho CHOE ,  Changseo PARK

IPC: H01L31/0236 ,  H01L31/18

CPC classification number: H01L31/02366 ,  H01L31/02168 ,  H01L31/022425 ,  H01L31/02363 ,  H01L31/068 ,  H01L31/18 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

Abstract: A semiconductor device includes a substrate and a first insulating layer. The first insulating layer includes a first lower layer and a first upper layer on the first lower layer. The first insulating layer has a first opening through the first lower layer and the first upper layer. A maximum width of the first opening at the first lower layer is different from a maximum width of the first opening at the first upper layer.

Abstract translation: 半导体器件包括衬底和第一绝缘层。 第一绝缘层包括第一下层和第一下层上的第一上层。 第一绝缘层具有穿过第一下层和第一上层的第一开口。 第一下层的第一开口的最大宽度不同于第一上层的第一开口的最大宽度。

公开(公告)号：US20230299055A1

公开(公告)日：2023-09-21

申请号：US18020608

申请日：2020-08-10

Applicant: LG ELECTRONICS INC.

Inventor： Changseo PARK ,  Jinhyung LEE ,  Younho HEO ,  Yongil SHIN ,  Kisu KIM

IPC: H01L25/075 ,  H01L33/36 ,  H01L21/304 ,  H01L33/08 ,  H01L33/00

CPC classification number: H01L25/0753 ,  H01L33/36 ,  H01L21/3043 ,  H01L33/08 ,  H01L33/0095

Abstract: A method for manufacturing a substrate for manufacturing a display device, according to the present invention, comprises the steps of: (a) forming, at predetermined intervals, assembly electrodes extending in one direction on a base part, and forming a dielectric layer so as to cover the assembly electrodes; (b) forming, on the dielectric layer, metal patterns so as to overlap the assembly electrodes; (c) forming partition parts on the dielectric layer so as to cover the metal patterns, and then forming assembly holes so as to overlap the metal patterns; and (d) removing the metal patterns exposed through the assembly holes, wherein, in step (d), a groove part is formed on the surface of each partition part, which forms the inner surface of each assembly hole, as the metal patterns are removed.