公开(公告)号：US09620400B2

公开(公告)日：2017-04-11

申请号：US14536428

申请日：2014-11-07

Applicant: KLA-Tencor Corporation

Inventor： Earl Jensen ,  Kevin O'Brien

IPC: G01B11/14 ,  H01L21/68

CPC classification number: H01L21/68 ,  H01L21/681

Abstract: Some aspects of the present disclosure relate to a system having a substrate device, a substrate support surface, and a substrate handler that positions the substrate device on the substrate support surface. The substrate device and the substrate support surface may have counterpart coarse position units and fine position units. The system may measure coarse positional offsets between the first and second coarse position units, re-position the substrate device on the substrate support surface based on the coarse positional offsets, and subsequently measure fine positional offsets between the first and second fine position units. In some implementations, the substrate device is integrally coupled to the substrate handler via a wireless communication link in order to communicate position information as feedback for further placement.