公开(公告)号：US20140231934A1

公开(公告)日：2014-08-21

申请号：US13962885

申请日：2013-08-08

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Tomohiro SAITO

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0058 ,  B81B7/0035 ,  B81B7/0054 ,  B81C1/00277 ,  B81C2203/0136 ,  B81C2203/0145 ,  B81C2203/0163

Abstract: According to one embodiment, an electrical component comprises a substrate, a functional element formed on the substrate, a first layer configured to form a cavity which stores the functional element on the substrate, the first layer having through holes, the first layer having a first recessed portion and a first projecting portion on an upper surface thereof, and the first layer having different film thicknesses in a direction perpendicular to a surface of the substrate, and a second layer formed on the first layer and configured to close the through holes.

Abstract translation: 根据一个实施例，电气部件包括衬底，形成在衬底上的功能元件，第一层，被配置为形成将功能元件存储在衬底上的空腔，第一层具有通孔，第一层具有第一层 凹部和在其上表面上的第一突出部分，并且所述第一层在垂直于所述基板的表面的方向上具有不同的膜厚度;以及第二层，形成在所述第一层上并且被构造成闭合所述通孔。