公开(公告)号：US10106398B2

公开(公告)日：2018-10-23

申请号：US14724224

申请日：2015-05-28

Applicant: Infineon Technologies AG

Inventor： Ulrich Schmid ,  Tobias Frischmuth ,  Peter Irsigler ,  Thomas Grille ,  Daniel Maurer ,  Ursula Hedenig ,  Markus Kahn ,  Guenter Denifl ,  Michael Schneider

IPC: B81C1/00 ,  B81B3/00

Abstract: A micromechanical structure comprises a substrate and a functional structure arranged at the substrate. The functional structure comprises a functional region which is deflectable with respect to the substrate responsive to a force acting on the functional region. The functional structure comprises a carbon layer arrangement, wherein a basis material of the carbon layer arrangement is a carbon material.

公开(公告)号：US20180002167A1

公开(公告)日：2018-01-04

申请号：US15636702

申请日：2017-06-29

Applicant: Infineon Technologies AG

Inventor： Tobias Frischmuth ,  Guenter Denifl ,  Thomas Grille ,  Ursula Hedenig ,  Markus Kahn ,  Daniel Maurer ,  Ulrich Schmid ,  Michael Schneider

IPC: B81C1/00 ,  H04R19/04 ,  G01Q60/24 ,  H04R19/02 ,  B81B3/00 ,  G01L1/00

Abstract: A micromechanical structure in accordance with various embodiments may include: a substrate; and a functional structure arranged at the substrate; wherein the functional structure includes a functional region which is deflectable with respect to the substrate responsive to a force acting on the functional region; and wherein at least a section of the functional region has an elastic modulus in the range from about 5 GPa to about 70 GPa.

公开(公告)号：US10710874B2

公开(公告)日：2020-07-14

申请号：US15636702

申请日：2017-06-29

Applicant: Infineon Technologies AG

Inventor： Tobias Frischmuth ,  Guenter Denifl ,  Thomas Grille ,  Ursula Hedenig ,  Markus Kahn ,  Daniel Maurer ,  Ulrich Schmid ,  Michael Schneider

IPC: H04R19/00 ,  B81C1/00 ,  G01Q70/14 ,  H04R7/26 ,  G01L7/08 ,  G01L1/00 ,  B81B3/00 ,  G01Q60/24 ,  H04R19/02 ,  H04R7/10 ,  H04R19/04

Abstract: A micromechanical structure in accordance with various embodiments may include: a substrate; and a functional structure arranged at the substrate; wherein the functional structure includes a functional region which is deflectable with respect to the substrate responsive to a force acting on the functional region; and wherein at least a section of the functional region has an elastic modulus in the range from about 5 GPa to about 70 GPa.

公开(公告)号：US10462580B2

公开(公告)日：2019-10-29

申请号：US15928821

申请日：2018-03-22

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Yauheni Belahurau ,  Manuel Dorfmeister ,  Christoph Glacer ,  Manfred Kaltenbacher ,  Ulrich Schmid ,  Michael Schneider ,  David Tumpold

IPC: H04R19/02 ,  H04R1/00 ,  H04R17/00

Abstract: A microelectromechanical loudspeaker may include: a plurality of elementary loudspeakers each including a drive unit and a diaphragm deflectable by the drive unit, and a controller configured to respectively supply control signals to the drive units. The drive units may be respectively configured to deflect the corresponding diaphragms according to the respective control signals supplied by the controller to generate acoustic waves. The control signal supplied to at least one control unit may have at least one local extremum and a global extremum of a curvature of the control signal with a highest absolute value of the curvature may be located at a position of the control signal preceding a position of the at least one local extremum of the control signal.