公开(公告)号：US20030080393A1

公开(公告)日：2003-05-01

申请号：US10002447

申请日：2001-10-26

Applicant: International Business Machines Corporation

Inventor： Timothy J. Dalton ,  Kevin S. Petrarca ,  Richard P. Volant

IPC: H01L029/00

CPC classification number: H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A laser-programmable fuse structure for an integrated circuit device is disclosed. In an exemplary embodiment of the invention, the fuse structure includes a conductive layer, the conductive layer completing a conductive path between wiring segments in a wiring layer. An organic material is encapsulated underneath the conductive layer, wherein the fuse structure is blown open by application of a beam of laser energy thereto.

Abstract translation: 公开了一种用于集成电路器件的激光可编程熔丝结构。 在本发明的示例性实施例中，熔丝结构包括导电层，导电层在布线层中的布线段之间完成导电路径。 有机材料被封装在导电层下面，其中通过向其施加激光能量而将熔丝结构吹开。