公开(公告)号：US20190249929A1

公开(公告)日：2019-08-15

申请号：US16034050

申请日：2018-07-12

Applicant: General Electric Company

Inventor： Brian Magann Rush ,  Daniel Jason Erno ,  Thomas Adcock ,  Stefano Angelo Mario Lassini

IPC: F28D15/04 ,  B33Y80/00

Abstract: A cooling assembly includes walls extending around and defining an enclosed vapor chamber that holds a working fluid. An interior porous wick structure is disposed inside the chamber and lines interior surfaces of the walls. The wick structure includes pores that hold a liquid phase of the working fluid. The cooling assembly also includes an exterior porous wick structure lining exterior surfaces of the walls outside of the vapor chamber. The exterior wick structure includes pores that hold a liquid phase of a cooling fluid outside the vapor chamber. The interior wick structure holds the liquid working fluid until heat from an external heat source vaporizes the working fluid inside the vapor chamber. The exterior wick structure holds the liquid fluid outside the vapor chamber until heat from inside the vapor chamber vaporizes the liquid cooling fluid in the exterior wick structure for transferring heat away from the heat source.

公开(公告)号：US09974157B2

公开(公告)日：2018-05-15

申请号：US15237054

申请日：2016-08-15

Applicant: General Electric Company

Inventor： Hendrik Pieter Jacobus de Bock ,  Brian Magann Rush ,  Stefano Angelo Mario Lassini

IPC: H05K1/02 ,  H05K7/20 ,  H05K5/02

CPC classification number: H05K1/0203 ,  H05K5/0256 ,  H05K7/20309 ,  H05K7/2039 ,  H05K7/20672

Abstract: An electronic system includes a chassis. The chassis includes a first endwall, a second endwall, and a sidewall. The electronic system also includes at least one circuit card cartridge coupled to the chassis. The at least one circuit card cartridge is positioned between the first endwall and the second endwall. The at least one circuit card cartridge includes a printed circuit board including a first surface and at least one electronic component. The at least one electronic component is mounted on the first surface. The at least one circuit card cartridge further includes at least one heat transfer assembly coupled to the printed circuit board. The at least one heat transfer assembly is configured to contact the at least one electronic component and extend adjacent the printed circuit board across the first surface.