WAFER AND SYSTEM AND METHOD FOR TESTING THE WAFER
    12.
    发明申请
    WAFER AND SYSTEM AND METHOD FOR TESTING THE WAFER 审中-公开
    WAFER和系统及测试方法

    公开(公告)号:US20140332812A1

    公开(公告)日:2014-11-13

    申请号:US14189945

    申请日:2014-02-25

    CPC classification number: G01R31/3025 H01L22/32 H01L2223/6677

    Abstract: A wafer is provided. The wafer includes at least one field. The field includes at least one chip, and at least one test chip that generates power using a wireless signal, that provides power to the chip, that tests performance of the chip, and that corrects performance of the chip according to a test result.

    Abstract translation: 提供晶片。 晶片包括至少一个场。 该领域包括至少一个芯片,以及至少一个使用无线信号产生功率的测试芯片,其向芯片提供功率,测试芯片的性能,并根据测试结果来校正芯片的性能。

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