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公开(公告)号：US11255897B2
公开(公告)日：2022-02-22
申请号：US16229717
申请日：2018-12-21
Applicant: Cisco Technology, Inc.
Inventor： Mohammed Ghouse , Shailesh Nayak , Damaruganath Pinjala , Rohit Dev Gupta , Mehmet Onder Cap
Abstract: In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.
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公开(公告)号：US11234342B2
公开(公告)日：2022-01-25
申请号：US16842505
申请日：2020-04-07
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Mehmet Onder Cap , Manigandan Boopalan , Joel Richard Goergen , Sandeep Mehdiratta , Manjunatha Reddy Shivashankara , Damaruganath Pinjala
Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.
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公开(公告)号：US20220018891A1
公开(公告)日：2022-01-20
申请号：US17480773
申请日：2021-09-21
Applicant: Cisco Technology, Inc.
Inventor： Mohammed Ghouse , Shailesh Nayak , Damaruganath Pinjala , Rohit Dev Gupta , Mehmet Onder Cap
Abstract: In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.
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公开(公告)号：US20210112682A1
公开(公告)日：2021-04-15
申请号：US16842505
申请日：2020-04-07
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Mehmet Onder Cap , Manigandan Boopalan , Joel Richard Goergen , Sandeep Mehdiratta , Manjunatha Reddy Shivashankara , Damaruganath Pinjala
Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.
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