公开(公告)号：US20120168894A1

公开(公告)日：2012-07-05

申请号：US13241389

申请日：2011-09-23

Applicant: Min-Soo Kim ,  Hwan-Sung Cheon ,  Jee-Yun Song ,  Young-Min Kim ,  Cheol-Ho Lee ,  Chung-Heon Lee

Inventor： Min-Soo Kim ,  Hwan-Sung Cheon ,  Jee-Yun Song ,  Young-Min Kim ,  Cheol-Ho Lee ,  Chung-Heon Lee

IPC: H01L21/306 ,  H01L27/02 ,  C09D161/06

CPC classification number: G03F7/094

Abstract: A hard mask composition, a method of forming a pattern, and a semiconductor integrated circuit device, the hard mask composition including a solvent; and an aromatic ring-containing compound, the aromatic ring-containing compound including at least one of a moiety represented by the following Chemical Formula 1 and a moiety represented by the following Chemical Formula 2:

Abstract translation: 硬掩模组合物，形成图案的方法和半导体集成电路器件，所述硬掩模组合物包括溶剂; 和含芳香环的化合物，所述含芳香环的化合物包括由以下化学式1表示的部分和由以下化学式2表示的部分中的至少一个：