Memory module assembly including a clip for mounting a heat sink thereon
    11.
    发明授权
    Memory module assembly including a clip for mounting a heat sink thereon 失效
    存储器模块组件,包括用于在其上安装散热器的夹子

    公开(公告)号:US07349219B2

    公开(公告)日:2008-03-25

    申请号:US11308848

    申请日:2006-05-15

    IPC分类号: H05K7/20

    摘要: A memory module assembly includes a printed circuit board (30) having a heat-generating electronic component (32) thereon, a heat sink (10) and a clip (20) for securing the heat sink onto the heat-generating electronic component. The heat sink includes a base (12) and a plurality of fins (14) arranged on the base. A plurality of recesses is defined in the heat sink. The clip includes a body (22) resting against a face of the printed circuit board and elastic hooks (24) extending from the body. The hooks are received in the recesses and resiliently press the base of the heat sink toward the heat-generating electronic component, whereby the clip clamps the heat sink and the printed circuit board together.

    摘要翻译: 存储器模块组件包括其上具有发热电子部件(32)的印刷电路板(30),散热器(10)和用于将散热器固定到发热电子部件上的夹子(20)。 散热器包括基座(12)和布置在基座上的多个翅片(14)。 在散热器中限定多个凹部。 夹子包括靠在印刷电路板的表面上的主体(22)和从主体延伸的弹性钩(24)。 钩子被容纳在凹部中并将散热器的基座弹性地压向发热电子部件,由此夹子将散热器和印刷电路板夹在一起。

    MINIATURE PUMP FOR LIQUID COOLING SYSTEM
    12.
    发明申请
    MINIATURE PUMP FOR LIQUID COOLING SYSTEM 审中-公开
    液体冷却系统微型泵

    公开(公告)号:US20070224059A1

    公开(公告)日:2007-09-27

    申请号:US11308425

    申请日:2006-03-23

    IPC分类号: F04B17/00

    CPC分类号: F04D29/048 F04D13/0666

    摘要: A miniature pump in accordance with the present invention comprises a pump casing (10) and a liquid circulating unit (20) received in the pump casing. The pump casing comprises a hollow main body (14) transversely forming a spacing plate (126) and a partition wall (144) spaced from the spacing plate. The liquid circulating unit comprises a shaft (25) mounted between the partition wall and the spacing plate, a bearing (27) rotatably mounted the shaft, an impeller (26) attached to the bearing, a first pair of spaced magnetic spacers (21,22) surrounding an upper portion of the shaft and positioned above the bearing, and a second pair of spaced magnetic spacers (23, 24) surrounding a lower portion of the shaft and positioned below the bearing. The two pairs of magnetic spacers properly suspend the impeller in a stable position in an axial direction of the pump when the impeller rotates.

    摘要翻译: 根据本发明的微型泵包括容纳在泵壳体中的泵壳体(10)和液体循环单元(20)。 泵壳体包括横向地形成间隔板(126)的中空主体(14)和与间隔板间隔开的分隔壁(144)。 液体循环单元包括安装在分隔壁和间隔板之间的轴(25),可旋转地安装轴的轴承(27),附接到轴承的叶轮(26),第一对间隔开的磁性间隔件 22)围绕轴的上部并且定位在轴承上方,以及第二对间隔开的磁性间隔件(23,24),其围绕轴的下部并且定位在轴承的下方。 当叶轮旋转时,两对磁性间隔件将叶轮在泵的轴向方向上适当地悬挂在稳定的位置。

    MEMORY MODULE ASSEMBLY INCLUDING A CLAMP FOR MOUNTING HEAT SINKS THEREON
    13.
    发明申请
    MEMORY MODULE ASSEMBLY INCLUDING A CLAMP FOR MOUNTING HEAT SINKS THEREON 失效
    存储器模块组件,其中包括用于安装散热器的钳子

    公开(公告)号:US20070223198A1

    公开(公告)日:2007-09-27

    申请号:US11309226

    申请日:2006-07-13

    IPC分类号: H05K7/20

    摘要: A memory module assembly includes a pair of heat-dissipation plates (10), a printed circuit board (20) sandwiched between the heat-dissipation plates (10), and four clamps (30) for securing the heat-dissipation plates (10) onto opposite sides of the printed circuit board (20). Each clamp includes a connecting portion (32) and a pair of elastic pressing portions (34) extending from opposite free ends of the connecting portion. Each pressing portion has a pair of hooks (342) extending from opposite lateral sides thereof and an engaging portion extending (344) from a free end thereof and clamping on an end of the heat-dissipation plate. The hooks are inserted into openings (18) defined in the heat-dissipation plates and engage with inner surfaces of the heat-dissipation plates.

    摘要翻译: 存储模块组件包括一对散热板(10),夹在散热板(10)之间的印刷电路板(20)和用于固定散热板(10)的四个夹具(30) 在印刷电路板(20)的相对侧上。 每个夹具包括连接部分(32)和从连接部分的相对的自由端延伸的一对弹性按压部分(34)。 每个按压部分具有从其相对侧面延伸的一对钩(342)和从其自由端延伸(344)并且夹持在散热板的端部上的接合部。 将钩插入到限定在散热板中的开口(18)中,并与散热板的内表面接合。

    Memory module assembly including a clip for mounting a heat sink thereon
    14.
    发明授权
    Memory module assembly including a clip for mounting a heat sink thereon 失效
    存储器模块组件,包括用于在其上安装散热器的夹子

    公开(公告)号:US07457122B2

    公开(公告)日:2008-11-25

    申请号:US11309225

    申请日:2006-07-13

    IPC分类号: H05K7/20

    摘要: A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (14) thereon, and first and second heat-dissipation plates (20), (30) attached on opposite sides of the printed circuit board. The first heat-dissipation plate includes a first hook (24) extending from a side thereof and the first hook includes a resisting portion (242) extending from an end of the first heat-dissipation plate and a first engaging portion (244) extending from a free end of the resisting portion for resisting the printed circuit board and the second heat-dissipation plate. The second heat-dissipation plate defines a depressed portion (34) in a side thereof for engaging with the first hook. The other sides of the first and second heat-dissipation plates engage with each other to clamp the printed circuit board between the first and second heat-dissipation plates.

    摘要翻译: 存储模块组件包括其上具有发热电子部件(14)的印刷电路板(10)和安装在印刷电路板的相对侧上的第一和第二散热板(20),(30)。 第一散热板包括从其一侧延伸的第一钩(24),第一钩包括从第一散热板的端部延伸的阻挡部分(242)和从第一散热板的一端延伸的第一接合部分(244) 用于抵抗印刷电路板和第二散热板的抵抗部分的自由端。 第二散热板在其一侧限定了与第一钩接合的凹部(34)。 第一和第二散热板的另一侧彼此接合以将印刷电路板夹在第一和第二散热板之间。

    Light emitting diode module having a latching component and a heat-dissipating device
    15.
    发明授权
    Light emitting diode module having a latching component and a heat-dissipating device 失效
    具有闭锁部件和散热装置的发光二极管模块

    公开(公告)号:US07438449B2

    公开(公告)日:2008-10-21

    申请号:US11621759

    申请日:2007-01-10

    IPC分类号: B60Q1/06

    摘要: An LED module includes a latching component, a frame holding an LED thereon, a heat spreader located in the latching component and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The latching component cooperates with the heat spreader to tightly press the frame being attached on the heat spreader. The heat transfer member thermally connects with the heat spreader and transfers heat from the LED to an ambient environment. The latching component has two spring pieces pushing the frame toward the heat spreader and the heat pipe. The spring pieces electrically engage with the frame to thereby electrically connect with the LED.

    摘要翻译: LED模块包括闩锁部件,保持LED的框架,位于闩锁部件中的散热器和具有远离LED的散热单元和与散热器热连接的热管的传热部件, LED和散热单元。 闩锁部件与散热器配合,以紧紧地按压附着在散热器上的框架。 传热构件与散热器热连接并将热量从LED传递到周围环境。 闩锁部件具有两个弹簧片,将框架推向散热器和热管。 弹簧片与框架电接合,从而与LED电连接。

    Memory module assembly including a clamp for mounting heat sinks thereon
    16.
    发明授权
    Memory module assembly including a clamp for mounting heat sinks thereon 失效
    存储器模块组件,包括用于在其上安装散热器的夹具

    公开(公告)号:US07391613B2

    公开(公告)日:2008-06-24

    申请号:US11308839

    申请日:2006-05-12

    IPC分类号: H05K7/20

    摘要: A memory module assembly includes a printed circuit board (10) having a main heat-generating electronic component (52) thereon, first and second heat sinks (20), (30) attached on opposite sides of the printed circuit board and a clamp (40) clamping the first, second heat sinks and the printed circuit board together. The first heat sink comprises a pair of positioning poles (24). The second heat sink comprises a heat pipe (36) disposed therein and thermally connecting therewith. The clamp comprises a connecting portion (42) and a pair of elastic pressing portions (44). The clamp resiliently presses the second heat sink toward the main heat-generating electronic component and the first heat sink engages with the second heat sink via the positioning poles of the first heat sink extending in and engaging with the second heat sink.

    摘要翻译: 存储模块组件包括其上具有主要发热电子部件(52)的印刷电路板(10),安装在印刷电路板的相对侧上的第一和第二散热器(20),(30)和夹具 40)将第一,第二散热器和印刷电路板夹在一起。 第一散热器包括一对定位极(24)。 第二散热器包括设置在其中并与其热连接的热管(36)。 夹具包括连接部分(42)和一对弹性按压部分(44)。 夹具将第二散热器弹性地压向主发热电子部件,并且第一散热器经由第一散热器的定位极与第二散热器接合,第一散热器的定位极延伸并与第二散热器接合。

    Gas-liquid separation apparatus
    17.
    发明申请
    Gas-liquid separation apparatus 失效
    气液分离装置

    公开(公告)号:US20080098898A1

    公开(公告)日:2008-05-01

    申请号:US11309918

    申请日:2006-10-27

    IPC分类号: B01D19/00

    摘要: A gas-liquid separation apparatus includes a crust and a separating pipe located in the crust. The crust includes an annular wall and two lids covering two ends of the wall. The crust has a cavity surrounded by the wall and the two lids. An inlet extends through one lid and an outlet extends through the other lid. The separating pipe is disposed in the cavity of the crust and in communication with the inlet and the outlet of the crust. A plurality of apertures is defined in a body of the separating pipe and in communication with a space inside the separating pipe and the cavity of the crust. The liquid with gas dissolved therein enters into the separating pipe via the inlet of the crust. The liquid is degassed by the separating pipe. The de-gassed liquid exits the separating pipe via the outlet of the crust.

    摘要翻译: 气液分离装置包括位于地壳中的外壳和分离管。 地壳包括一个环形壁,两个盖子覆盖墙壁的两端。 地壳有一个由墙壁和两个盖子包围的空腔。 入口延伸穿过一个盖子,出口延伸穿过另一个盖子。 分离管设置在地壳的空腔中并与地壳的入口和出口连通。 多个孔被限定在分离管的主体中并且与分离管和地壳的空腔内的空间连通。 溶解有气体的液体通过外壳的入口进入分离管。 液体被分离管脱气。 脱气液体经由外壳的出口离开分离管。

    MINIATURE LIQUID COOLING DEVICE HAVING AN INTEGRAL PUMP THEREIN
    18.
    发明申请
    MINIATURE LIQUID COOLING DEVICE HAVING AN INTEGRAL PUMP THEREIN 失效
    具有整体泵的微型液体冷却装置

    公开(公告)号:US20080075611A1

    公开(公告)日:2008-03-27

    申请号:US11309748

    申请日:2006-09-21

    IPC分类号: F04B17/00

    CPC分类号: F04D13/0606

    摘要: A miniature liquid cooling device includes a casing (10) defining a first chamber (102), a second chamber (104) and a third chamber (106) communicating with the first chamber. The first and the third chambers cooperatively form a work channel for liquid. An impeller (21) is rotatably mounted in the first chamber to circulate the liquid. A filter (17) is mounted in the second chamber and defines a plurality of orifices (1704). When the impeller rotates the liquid firstly enters the second chamber via an inlet (122) and flows through the filter, whereby air bubbles in the liquid leave the liquid and escape from the filter via the orifices. The escaped air bubbles enter the second chamber. The deaerated liquid flows into the work channel and finally is driven to flow out of the liquid cooling device via an outlet (124).

    摘要翻译: 微型液体冷却装置包括限定第一室(102)的壳体(10),与第一室连通的第二室(104)和第三室(106)。 第一和第三室协同地形成液体的工作通道。 叶轮(21)可旋转地安装在第一室中以使液体循环。 过滤器(17)安装在第二室中并限定多个孔(1704)。 当叶轮旋转时,液体首先通过入口(122)进入第二室并流过过滤器,由此液体中的气泡离开液体并经过孔从过滤器逸出。 逸出的气泡进入第二个室。 脱气液体流入工作通道,最后通过出口(124)被驱动流出液体冷却装置。

    Memory module assembly including a clip for mounting a heat sink thereon
    19.
    发明授权
    Memory module assembly including a clip for mounting a heat sink thereon 失效
    存储器模块组件,包括用于在其上安装散热器的夹子

    公开(公告)号:US07333338B2

    公开(公告)日:2008-02-19

    申请号:US11308073

    申请日:2006-03-05

    IPC分类号: H05K7/20

    摘要: A memory module assembly (1) includes a printed circuit board (10) having an electronic heat-generating electronic component (40) thereon, a heat sink (20) and a clip (30) for securing the heat sink onto the heat-generating electronic component. The clip includes a pressing portion (32) and a pair of latching portions (33) respectively extending from two ends of the pressing portion. Each latching portion includes a latching leg (332) and a retaining hook section (334) formed at a bottom end of the latching leg. The retaining hook sections tightly engage a bottom face of the printed circuit board and the pressing portion presses the base toward the heat-generating electronic component. The latching legs extend through an opening and a through hole in the printed circuit board. The through hole has a L-shaped configuration and does not communicate with a periphery side of the printed circuit board.

    摘要翻译: 存储模块组件(1)包括其上具有电子发热电子部件(40)的印刷电路板(10),散热器(20)和夹子(30),用于将散热器固定在发热 电子元件 夹具包括分别从按压部分的两端延伸的按压部分(32)和一对闩锁部分(33)。 每个闩锁部分包括锁定腿部(332)和形成在锁定腿部的底端处的保持钩部分(334)。 保持钩部分紧密接合印刷电路板的底面,并且按压部分将基部朝向发热电子部件按压。 闩锁腿延伸穿过印刷电路板中的开口和通孔。 通孔具有L形构造,并且不与印刷电路板的周边侧连通。

    MEMORY MODULE ASSEMBLY INCLUDING A CLIP FOR MOUNTING A HEAT SINK THEREON
    20.
    发明申请
    MEMORY MODULE ASSEMBLY INCLUDING A CLIP FOR MOUNTING A HEAT SINK THEREON 失效
    存储模块组件,其中包括用于安装散热片的夹子

    公开(公告)号:US20070206359A1

    公开(公告)日:2007-09-06

    申请号:US11308073

    申请日:2006-03-05

    IPC分类号: H05K7/20

    摘要: A memory module assembly (1) includes a printed circuit board (10) having an electronic heat-generating electronic component (40) thereon, a heat sink (20) and a clip (30) for securing the heat sink onto the heat-generating electronic component. The clip includes a pressing portion (32) and a pair of latching portions (33) respectively extending from two ends of the pressing portion. Each latching portion includes a latching leg (332) and a retaining hook section (334) formed at a bottom end of the latching leg. The retaining hook sections tightly engage a bottom face of the printed circuit board and the pressing portion presses the base toward the heat-generating electronic component. The latching legs extend through an opening and a through hole in the printed circuit board. The through hole has a L-shaped configuration and does not communicate with a periphery side of the printed circuit board.

    摘要翻译: 存储模块组件(1)包括其上具有电子发热电子部件(40)的印刷电路板(10),散热器(20)和夹子(30),用于将散热器固定在发热 电子元件 夹具包括分别从按压部分的两端延伸的按压部分(32)和一对闩锁部分(33)。 每个闩锁部分包括锁定腿部(332)和形成在锁定腿部的底端处的保持钩部分(334)。 保持钩部分紧密接合印刷电路板的底面,并且按压部分将基部朝向发热电子部件按压。 闩锁腿延伸穿过印刷电路板中的开口和通孔。 通孔具有L形构造,并且不与印刷电路板的周边侧连通。