公开(公告)号：US20180186693A1

公开(公告)日：2018-07-05

申请号：US15906225

申请日：2018-02-27

Applicant: Corning Incorporated

Inventor： Johannes Moll ,  James Joseph Price ,  Alranzo Boh Ruffin ,  Sergio Tsuda ,  Robert Stephen Wagner ,  James Joseph Watkins

IPC: C03C23/00 ,  B44C1/22 ,  B41M5/24 ,  C03C21/00

CPC classification number: C03C23/0025 ,  B41M5/24 ,  B44C1/227 ,  B44C1/228 ,  C03C21/002 ,  Y10T428/24479 ,  Y10T428/24521

Abstract: Strengthened glass articles having laser etched features, electronic devices, and methods of fabricating etched features in strengthened glass articles are disclosed. In one embodiment, a strengthened glass article includes a first strengthened surface layer and a second strengthened surface layer under a compressive stress and extending from a first surface and a second surface, respectively, of the strengthened glass article to a depth of layer, and a central region between the first strengthened surface layer and the second strengthened surface layer that is under tensile stress. The strengthened glass article further includes at least one etched feature formed by laser ablation within the first surface or the second surface having a depth that is less than the depth of layer and a surface roughness that is greater than a surface roughness of the first surface or second surface outside of the at least one etched feature.

公开(公告)号：US20170334762A1

公开(公告)日：2017-11-23

申请号：US15524703

申请日：2015-11-05

Applicant: CORNING INCORPORATED

Inventor： Donald Orrin Bigelow ,  Robertson Dewhurst Booth ,  James Joseph Watkins

IPC: C03B33/09 ,  C03B33/10 ,  C03B33/023 ,  C03B33/03

CPC classification number: C03B33/091 ,  C03B33/0235 ,  C03B33/03 ,  C03B33/105

Abstract: A method for forming an initiation defect in a glass substrate to facilitate separating the glass substrate into a plurality of substrates is provided. The method includes providing the glass substrate and contacting a broad surface of the glass substrate with an abrasive surface thereby forming a field of initiation defects in the broad surface of the glass substrate. The field of initiation defects has a width of at least about three millimetres between outermost initiation defects. At least one initiation defect is heated with a laser source. The at least one initiation defect is cooled with a cooling fluid such that a crack initiates from the at least one initiation defect, the crack extending through a thickness of the glass substrate and propagating across the glass substrate to separate the glass substrate into the plurality of substrates.

公开(公告)号：US20130273324A1

公开(公告)日：2013-10-17

申请号：US13800033

申请日：2013-03-13

Applicant: CORNING INCORPORATED

Inventor： Johannes Moll ,  James Joseph Price ,  Alranzo Boh Ruffin ,  Sergio Tsuda ,  Robert Stephen Wagner ,  James Joseph Watkins

IPC: C03C23/00

CPC classification number: C03C23/0025 ,  B41M5/24 ,  B44C1/227 ,  B44C1/228 ,  C03C21/002 ,  Y10T428/24479 ,  Y10T428/24521

Abstract: Strengthened glass articles having laser etched features, electronic devices, and methods of fabricating etched features in strengthened glass articles are disclosed. In one embodiment, a strengthened glass article includes a first strengthened surface layer and a second strengthened surface layer under a compressive stress and extending from a first surface and a second surface, respectively, of the strengthened glass article to a depth of layer, and a central region between the first strengthened surface layer and the second strengthened surface layer that is under tensile stress. The strengthened glass article further includes at least one etched feature formed by laser ablation within the first surface or the second surface having a depth that is less than the depth of layer and a surface roughness that is greater than a surface roughness of the first surface or second surface outside of the at least one etched feature.

Abstract translation: 公开了具有激光蚀刻特征的加强玻璃制品，电子装置和在加强玻璃制品中制造蚀刻特征的方法。 在一个实施例中，加强的玻璃制品在压缩应力下包括第一加强表面层和第二增强表面层，并且分别从强化玻璃制品的第一表面和第二表面延伸到层的深度， 第一强化表面层和处于拉伸应力的第二强化表面层之间的中心区域。 所述强化玻璃制品还包括至少一个蚀刻特征，所述蚀刻特征通过在所述第一表面或所述第二表面内的激光烧蚀形成，所述蚀刻特征具有小于所述层的深度的深度和大于所述第一表面的表面粗糙度的表面粗糙度， 在所述至少一个蚀刻特征之外的第二表面。

公开(公告)号：US10252931B2

公开(公告)日：2019-04-09

申请号：US14993236

申请日：2016-01-12

Applicant: Corning Incorporated

Inventor： Moussa N'Gom ,  Garrett Andrew Piech ,  James Joseph Watkins ,  Kristopher Allen Wieland ,  Chad Michael Wilcox

IPC: B32B3/10 ,  C03B33/02 ,  B23K26/38 ,  B23K26/402 ,  B23K26/0622 ,  B23K26/359 ,  B23K26/53 ,  B23K103/00

Abstract: Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered substrate. The focused pulsed laser beam is pulsed to form a sequence of pulse bursts comprising one or more sub-pulses. The laser beam focal line produces a damage track within the bulk of the tempered substrate along the laser beam focal line. Relative motion is provided between the focused pulsed laser beam and the tempered substrate such that the pulsed laser beam forms a sequence of damage tracks within the tempered substrate. Individual damage tracks of the sequence of damage tracks are separated by a lateral spacing, and one or more microcracks connect adjacent damage tracks of the sequence of damage tracks.

公开(公告)号：US20170050877A1

公开(公告)日：2017-02-23

申请号：US15120003

申请日：2015-02-17

Applicant: Corning Incorporated

Inventor： Andrew Stephen Altman ,  Carlton Wesley Cole ,  Todd Benson Fleming ,  Anping Liu ,  James Joseph Watkins

IPC: C03B33/09 ,  C03B33/02 ,  C03B33/04

CPC classification number: C03B33/091 ,  B23K26/14 ,  B23K26/53 ,  B23K2103/54 ,  C03B33/0222 ,  C03B33/04 ,  Y02P40/57

Abstract: Methods and apparatus provide for: cutting a thin glass sheet along a curved cutting line, where the curve is divided into a plurality of line segments; applying a laser beam and continuously moving the laser beam along the cutting line; applying a cooling fluid simultaneously with the application of the laser beam in order to propagate a fracture in the glass sheet along the cutting line; and varying one or more cutting parameters as the laser beam moves from one of the plurality of line segments to a next one of the plurality of line segments, wherein the one or more cutting parameters include at least one of: (i) a power of the laser beam, (ii) a speed of the movement, (iii) a pressure of the cooling fluid, and (iv) a flow rate of the cooling fluid.

Abstract translation: 方法和装置提供：沿着弯曲切割线切割薄玻璃板，其中曲线被分成多个线段; 施加激光束并沿切割线连续移动激光束; 与施加激光束同时施加冷却流体，以沿着切割线传播玻璃板中的断裂; 以及随着所述激光束从所述多个线段之一移动到所述多个线段中的下一个线段而改变一个或多个切割参数，其中所述一个或多个切割参数包括以下中的至少一个：（i） 激光束，（ii）运动速度，（iii）冷却流体的压力，和（iv）冷却流体的流量。

公开(公告)号：US20150059411A1

公开(公告)日：2015-03-05

申请号：US14466460

申请日：2014-08-22

Applicant: Corning Incorporated

Inventor： Geunsik Lim ,  Robert Stephen Wagner ,  James Joseph Watkins

IPC: C03B33/08 ,  C03B33/023

CPC classification number: C03B33/082 ,  B23K26/0624 ,  B23K26/0643 ,  B23K26/361 ,  B23K2103/54 ,  B65G2249/04 ,  C03B33/0222 ,  C03B33/023 ,  C03B33/07 ,  C03C23/0025

Abstract: A method of separating a thin glass substrate from a carrier plate to which edge portions of the glass substrate are bonded, including irradiating a surface of the glass substrate with a pulsed laser beam, the laser beam moving along a plurality of parallel scan paths within a raster envelope, producing relative motion between the raster envelope and the glass substrate so that the raster envelope is moved along an irradiation path on the unbonded central portion. The irradiating produces ablation of the glass substrate along the irradiation path that forms a channel having a width W1 at the first surface greater than a width W2 at the second surface and extending through the thickness of the glass substrate, thus separating a thin glass sheet from the glass substrate-carrier plate assembly.

Abstract translation: 将薄玻璃基板与玻璃基板的边缘部分接合的载体板分离的方法，包括用脉冲激光束照射玻璃基板的表面，激光束沿着多个平行的扫描路径移动， 光栅包围，产生光栅包络和玻璃基底之间的相对运动，使得光栅包络沿着未结合的中心部分上的照射路径移动。 照射产生沿着照射路径的玻璃基板的烧蚀，所述照射路径形成在第一表面处的宽度W1大于第二表面处的宽度W2并且延伸穿过玻璃基板的厚度的通道，从而将薄玻璃板从 玻璃基板载体板组件。