公开(公告)号：US11740283B2

公开(公告)日：2023-08-29

申请号：US17834035

申请日：2022-06-07

Applicant: CHROMA ATE INC.

Inventor： Chin-Yi Ouyang ,  Chien-Ming Chen ,  Wei-Cheng Kuo ,  Xin-Yi Wu ,  Iching Tsai

IPC: G01R31/28 ,  G01R1/04

CPC classification number: G01R31/2893 ,  G01R1/0458

Abstract: The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.

公开(公告)号：US11333704B2

公开(公告)日：2022-05-17

申请号：US16559701

申请日：2019-09-04

Applicant: Chroma Ate Inc.

Inventor： Chin-Yi Ouyang ,  Chien-Ming Chen ,  Meng-Kung Lu

IPC: G01R31/28 ,  G01R1/04

Abstract: The invention relates to a sliding test device for electronic components, which mainly comprises a base, a sliding frame and a pressing member, wherein an electronic component to be tested is placed in a chip receiving module of the base, and the sliding frame is slidably moved with respect to the base under sliding engagement between a first sliding guide and a second sliding guide so that a pressing block of the pressing member is aligned with the electronic component presses the electronic component. According to the present invention, the pressing member presses the electronic component and exerts a sufficient contact force on the electronic component, and a reaction force caused by the contact force and the elastic restoring force of probes is internally balanced in the device.