公开(公告)号：US20190006197A1

公开(公告)日：2019-01-03

申请号：US15991374

申请日：2018-05-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD. ,  BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.

Inventor： Yuanxin Du ,  Zhidong Wang ,  Lianjie Qu ,  Yonglian Qi ,  Yun Qiu ,  Zhenhua Lv

IPC: H01L21/56 ,  H01L23/31 ,  H01L21/02 ,  H01L23/544 ,  H01L29/06 ,  H01L21/78

Abstract: A wafer part and a chip packaging method are provided. The wafer part is obtained by processing a round wafer. A profile of the wafer part is an inscribed closed pattern of a profile of the round wafer, and area of the inscribed closed pattern is larger than area of an inscribed square of the profile of the round wafer; the inscribed closed pattern includes an even number of straight edges, and each one of straight edges is parallel to another of the straight edges and has a length equal to that of the another of the straight edges. The chip packaging method includes: fixing the plurality of wafer parts on a first panel level substrate and forming a packaging structure on each chip; wherein the plurality of wafer parts are arranged closely on the first panel level substrate without being overlapped with each other.