公开(公告)号：US11508634B2

公开(公告)日：2022-11-22

申请号：US17063571

申请日：2020-10-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Syu-Tang Liu ,  Min Lung Huang

IPC: H01L23/31 ,  H01L23/552

Abstract: A semiconductor package structure, an electronic device, and method for manufacturing the same are provided. The semiconductor package structure includes a wiring structure, a first electronic device, a second electronic device, and a protection material. The first electronic device is disposed on the wiring structure. The second electronic device is disposed on the wiring structure. The second electronic device defines a plurality of recesses on a first lateral side surface thereof. The protection material is disposed on the wiring structure and encapsulates the recesses of the second electronic device.

公开(公告)号：US11107881B2

公开(公告)日：2021-08-31

申请号：US16395156

申请日：2019-04-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao Hsuan Chuang ,  Huang-Hsien Chang ,  Min Lung Huang ,  Yu Cheng Chen ,  Syu-Tang Liu

IPC: H01L49/02

Abstract: The subject application relates to a semiconductor package device, which includes a first conductive layer; a semiconductor wall disposed on the first conductive layer; a first conductive wall disposed on the first conductive layer; and an insulation layer disposed on the first conductive layer and between the semiconductor wall and the first conductive wall.