公开(公告)号：US20230031443A1

公开(公告)日：2023-02-02

申请号：US17788806

申请日：2020-12-08

Applicant: ASML Holding N.V.

Inventor： Matthew LIPSON ,  Mehmet Ali AKBAS ,  Tammo UITTERDIJK ,  Fei ZHAO

IPC: G03F7/20

Abstract: Systems, apparatuses, and methods are provided for manufacturing a wafer clamp having hard burls. The method can include providing a first layer that includes a first surface. The method can further include forming a plurality of burls over the first surface of the first layer. The forming of the plurality of burls can include forming a subset of the plurality of burls to a hardness of greater than about 6.0 gigapascals (GPa).

公开(公告)号：US20230314962A1

公开(公告)日：2023-10-05

申请号：US18012317

申请日：2021-06-04

Applicant: ASML Holding N.V.

Inventor： Tammo UITTERDIJK

IPC: G03F7/20 ,  H01L21/67 ,  H01L21/683

CPC classification number: G03F7/70783 ,  G03F7/70708 ,  H01L21/67288 ,  H01L21/6831

Abstract: Systems, apparatuses, methods, and computer program products are provided for determining a free form flatness of a substrate table. An example system can include a substrate table that includes a first substrate table surface and a grounded substrate table electrical connection configured to ground the substrate table. The system can further include a substrate that includes a semiconducting layer, a thermally-grown insulating layer, a first substrate surface disposed on the insulating layer, and a substrate electrical connection configured to transmit a voltage to the semiconducting layer. The system can further include a metrology system configured to apply a voltage to the substrate electrical connection to electrostatically clamp the substrate to the substrate table, measure a flatness of the first substrate surface, and determine a free form flatness of the first substrate table surface based on the measured flatness of the first substrate surface.

公开(公告)号：US20210405539A1

公开(公告)日：2021-12-30

申请号：US17291086

申请日：2019-10-22

Applicant: ASML Holding N.V.

Inventor： Mehmet Ali AKBAS ,  Tammo UITTERDIJK ,  Christopher John MASON ,  Matthew LIPSON ,  David Hart PETERSON ,  Michael PERRY ,  Peter HELMUS ,  Jerry Jianguo DENG ,  Damoon SOHRABIBABAHEIDARY

IPC: G03F7/20 ,  H01L21/687

Abstract: A method for reducing sticking of an object to a surface used in a lithography process includes receiving, at a control computer, instructions for a tool configured to modify the surface and forming, in a deterministic manner based on the instructions received at the control computer, a modified surface having a furrow and a ridge, wherein the ridge reduces the sticking by reducing a contact surface area of the modified surface. Another apparatus includes a modified surface that includes furrows and ridges forming a reduced contact surface area to reduce a sticking of an object to the modified surface, the ridges having an elastic property that causes the reduced contact surface area to increase when the plurality of ridges is elastically deformed.

公开(公告)号：US20240369947A1

公开(公告)日：2024-11-07

申请号：US18773176

申请日：2024-07-15

Applicant: ASML Holding N.V.

Inventor： Mehmet Ali AKBAS ,  Tammo UITTERDIJK ,  Christopher John MASON ,  Matthew LIPSON ,  David Hart PETERSON ,  Michael PERRY ,  Peter HELMUS ,  Jerry Jianguo DENG ,  Damoon SOHRABIBABAHEIDARY

IPC: G03F7/00 ,  H01L21/687

Abstract: A method for reducing sticking of an object to a surface used in a lithography process includes receiving, at a control computer, instructions for a tool configured to modify the surface and forming, in a deterministic manner based on the instructions received at the control computer, a modified surface having a furrow and a ridge, wherein the ridge reduces the sticking by reducing a contact surface area of the modified surface. Another apparatus includes a modified surface that includes furrows and ridges forming a reduced contact surface area to reduce a sticking of an object to the modified surface, the ridges having an elastic property that causes the reduced contact surface area to increase when the plurality of ridges is elastically deformed.

公开(公告)号：US20170242345A1

公开(公告)日：2017-08-24

申请号：US15504749

申请日：2015-07-09

Applicant: ASML Holding N.V.

Inventor： Matthew LIPSON ,  Vincent DIMILIA ,  Ronald Peter TOTILLO ,  Tammo UITTERDIJK ,  Steven Michael ZIMMERMAN

IPC: G03F7/20 ,  H01L21/67 ,  H01L21/683

CPC classification number: G03F7/70708 ,  C03B23/20 ,  C03B25/02 ,  G03F7/70783 ,  G03F7/70875 ,  G03F7/7095 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833

Abstract: An electrostatic clamp (300) and a method for manufacturing the same is disclosed. The electrostatic clamp includes a first layer (302) having a first ultra-low expansion (ULE) material, a second layer (304) coupled to the first layer, having a second ULE material, and a third layer (306), coupled to the second layer, having a third ULE material. The electrostatic clamp further includes a plurality of fluid channels (316) located between the first layer and the second layer and a composite layer (308) interposed between the second layer and the third layer. The method for manufacturing the electrostatic clamp includes forming the plurality of fluid channels, disposing the composite layer on the third layer, and coupling the third layer to the second layer. The plurality of fluid channels is configured to carry a thermally conditioned fluid for temperature regulation of a clamped object.