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公开(公告)号：US11942576B2
公开(公告)日：2024-03-26
申请号：US17006663
申请日：2020-08-28
Applicant: Applied Materials, Inc
Inventor： Yingdong Luo , Lisong Xu , Sivapackia Ganapathiappan , Hou T. Ng , Byung Sung Kwak , Mingwei Zhu , Nag B. Patibandla
CPC classification number: H01L33/504 , C09K11/025 , C09K11/06 , H01L33/005 , C09K2211/1007 , C09K2211/1011 , C09K2211/1014 , C09K2211/1029 , C09K2211/1033 , C09K2211/1037 , C09K2211/1044 , C09K2211/1059 , C09K2211/1092 , C09K2211/185 , H01L2933/0041
Abstract: A photocurable composition includes a blue photoluminescent material, one or more monomers, and a photoinitiator that initiates polymerization of the one or more monomers in response to absorption of the ultraviolet light. The blue photoluminescent material is selected to absorb ultraviolet light with a maximum wavelength in a range of about 300 nm to about 430 nm and to emit blue light. The blue photoluminescent material also has an emission peak in a range of about 420 nm to about 480 nm. The full width at half maximum of the emission peak is less than 100 nm, and the photoluminescence quantum yield is in a range of 5% to 100%.
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公开(公告)号：US20240096854A1
公开(公告)日：2024-03-21
申请号：US18244466
申请日：2023-09-11
Applicant: Applied Materials, Inc.
Inventor： Zhiyong Li , Sivapackia Ganapathiappan , Kulandaivelu Sivanandan , Hao Yu , Hou T. Ng , Nag Patibandla , Mingwei Zhu , Lisong Xu , Kai Ding
IPC: H01L25/075
CPC classification number: H01L25/0753 , H01L33/56
Abstract: Processing methods are described that include forming a group of LED structures on a substrate layer to form a patterned LED substrate. The methods also include depositing a light absorption material on the pattered LED substrate, where the light absorption material includes at least one photocurable compound and at least one ultraviolet light absorbing material. The methods further include exposing a portion of the light absorption material to patterned light, wherein the patterned light cures the exposed portion of the light absorption material into pixel isolation structures. The methods additionally include depositing an isotropic layer on a top portion and a side portion of the pixel isolation structures, where the LED structures are substantially free of the as-deposited isotropic light reflecting layer.
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公开(公告)号：US11575071B2
公开(公告)日：2023-02-07
申请号：US17362794
申请日：2021-06-29
Applicant: Applied Materials, Inc.
Inventor： Mingwei Zhu , Nag B. Patibandla , Rongjun Wang , Daniel Lee Diehl , Vivek Agrawal , Anantha Subramani
Abstract: Oxygen controlled PVD AlN buffers for GaN-based optoelectronic and electronic devices is described. Methods of forming a PVD AlN buffer for GaN-based optoelectronic and electronic devices in an oxygen controlled manner are also described. In an example, a method of forming an aluminum nitride (AlN) buffer layer for GaN-based optoelectronic or electronic devices involves reactive sputtering an AlN layer above a substrate, the reactive sputtering involving reacting an aluminum-containing target housed in a physical vapor deposition (PVD) chamber with a nitrogen-containing gas or a plasma based on a nitrogen-containing gas. The method further involves incorporating oxygen into the AlN layer.
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公开(公告)号：US20220367763A1
公开(公告)日：2022-11-17
申请号：US17870769
申请日：2022-07-21
Applicant: Applied Materials, Inc.
Inventor： Yingdong Luo , Lisong Xu , Sivapackia Ganapathiappan , Hou T. Ng , Byung Sung Kwak , Mingwei Zhu , Nag B. Patibandla
Abstract: A light-emitting device includes a plurality of light-emitting diodes, a first cured composition over a first subset of the light-emitting diodes, and a second cured composition over a second subset of light-emitting diodes. The first cured composition includes a first photopolymer and a blue photoluminescent material that is an organic, organometallic, or polymeric material, embedded in the first photopolymer. The second cured composition includes a second photopolymer and a nanomaterial embedded in the second photopolymer. The nanomaterial is selected to emit red or green light in response.
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公开(公告)号：US20220302339A1
公开(公告)日：2022-09-22
申请号：US17671235
申请日：2022-02-14
Applicant: Applied Materials, Inc.
Inventor： Hou T. Ng , Nag Patibandla , Uma Sridhar , Sivapackia Ganapathiappan , Mingwei Zhu
IPC: H01L33/00 , H01L25/075 , H01L33/62
Abstract: Exemplary processing methods of forming an LED structure on a backplane may include coupling a first transfer substrate with an LED source substrate. The LED source substrate may include a plurality of fabricated LEDs. The coupling of the first transfer substrate may be produced with a first coupling material extending between the first transfer substrate and each LED of the plurality of fabricated LEDs. The methods may include separating the LED source substrate from the LEDs. The methods may include coupling a second transfer substrate with the first transfer substrate. The coupling of the first transfer substrate may be produced with a second coupling material extending between the second transfer substrate and each LED of the plurality of fabricated LEDs. The methods may include separating the first transfer substrate from the second transfer substrate. The methods may include bonding the plurality of fabricated LEDs with a display backplane.
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Patent Agency Ranking
公开(公告)号：US20220189933A1
公开(公告)日：2022-06-16
申请号：US17587524
申请日：2022-01-28
Applicant: Applied Materials, Inc.
Inventor： Daihua Zhang , Yingdong Luo , Mingwei Zhu , Hou T. Ng , Sivapackia Ganapathiappan , Nag B. Patibandla
IPC: H01L25/075 , H01L33/00 , H01L33/50 , H01L33/32
Abstract: A multi-color display includes a backplane having backplane circuitry, an array of micro-LEDs electrically integrated with backplane circuitry of the backplane, a cover layer spanning the LEDs and having a plurality of recesses, and first and second color conversion layers. Each recess of the plurality of recesses positioned over a corresponding micro-LED from the plurality of micro-LEDs, the first color conversion layer is in each recess over a first plurality of LEDs to convert the illumination from the first plurality of LEDs to light of a first color, and the second color conversion layer is in each recess over a second plurality of LEDs to convert the illumination from the second plurality of LEDs to light of a different second color.
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公开(公告)号：US20220165789A1
公开(公告)日：2022-05-26
申请号：US17670374
申请日：2022-02-11
Applicant: Applied Materials, Inc.
Inventor： Mingwei Zhu , Sivapackia Ganapathiappan , Boyi Fu , Hou T. Ng , Nag B. Patibandla
Abstract: An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate
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公开(公告)号：US20220149250A1
公开(公告)日：2022-05-12
申请号：US17522148
申请日：2021-11-09
Applicant: Applied Materials, Inc.
Inventor： Robert Anthony Nordsell , Mingwei Zhu , Nag Patibandla , John D. Busch , Moon Young Shin , Asha Parekh , Hou T. Ng
IPC: H01L33/50 , H01L25/075 , H01L33/00 , H01L33/60
Abstract: Exemplary pixel structures may include a pixel structure of a display device panel stack. The structures may include a first panel. The first panel may include a plurality of ultraviolet light sources disposed on a backplane. The structures may also include a second panel. The second panel may be coupled with the first panel. The second panel may have an inner surface facing the ultraviolet light sources. The second panel may include a transparent substrate and a down-conversion layer. The down-conversion layer may be disposed overlying the transparent substrate. The down-conversion layer may be configured to down-convert ultraviolet light into visible light. The plurality of ultraviolet light sources and the inner surface of the second panel may be separated by a distance of at least 2 μm.
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公开(公告)号：US20220013707A1
公开(公告)日：2022-01-13
申请号：US17178188
申请日：2021-02-17
Applicant: Applied Materials, Inc.
Inventor： Zihao Yang , Mingwei Zhu , Shriram Mangipudi , Mohammad Kamruzzaman Chowdhury , Shane Lavan , Zhebo Chen , Yong Cao , Nag B. Patibandla
IPC: H01L39/24
Abstract: A method of fabricating a device including a superconductive layer includes depositing a seed layer on a substrate, exposing the seed layer to an oxygen-containing gas or plasma to form a modified seed layer, and after exposing the seed layer to the oxygen-containing gas or plasma depositing a metal nitride superconductive layer directly on the modified seed layer. The seed layer is a nitride of a first metal, and the superconductive layer is a nitride of a different second metal.
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公开(公告)号：US20210013258A1
公开(公告)日：2021-01-14
申请号：US16908462
申请日：2020-06-22
Applicant: Applied Materials, Inc.
Inventor： Mingwei Zhu , Sivapackia Ganapathiappan , Boyi Fu , Hou T. Ng , Nag B. Patibandla
Abstract: An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate
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