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公开(公告)号:US11960339B2
公开(公告)日:2024-04-16
申请号:US17371459
申请日:2021-07-09
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor: Eric J. Chapman , Alan D. Smith , Edward Chang
Abstract: A multi-die processor semiconductor package includes a first base integrated circuit (IC) die configured to provide, based at least in part on an indication of a configuration of a first plurality of compute dies 3D stacked on top of the first base IC die, a unique power domain to each of the first plurality of compute dies. In some embodiments, the semiconductor package also includes a second base IC die including a second plurality of compute dies 3D stacked on top of the second base IC die and an interconnect communicably coupling the first base IC die to the second base IC die.
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公开(公告)号:US11687251B2
公开(公告)日:2023-06-27
申请号:US17487247
申请日:2021-09-28
Applicant: ADVANCED MICRO DEVICES, INC. , ATI TECHNOLOGIES ULC
Inventor: Joseph L. Greathouse , Alan D. Smith , Francisco L. Duran , Felix Kuehling , Anthony Asaro
CPC classification number: G06F3/0619 , G06F3/064 , G06F3/0644 , G06F3/0659 , G06F3/0673 , G06F12/0607
Abstract: Systems and methods for dynamic repartitioning of physical memory address mapping involve relocating data stored at one or more physical memory locations of one or more memory devices to another memory device or mass storage device, repartitioning one or more corresponding physical memory maps to include new mappings between physical memory addresses and physical memory locations of the one or more memory devices, then loading the relocated data back onto the one or more memory devices at physical memory locations determined by the new physical address mapping. Such dynamic repartitioning of the physical memory address mapping does not require a processing system to be rebooted and has various applications in connection with interleaving reconfiguration and error correcting code (ECC) reconfiguration of the processing system.
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