Energy reservation coordination for hybrid vehicle
    12.
    发明授权
    Energy reservation coordination for hybrid vehicle 有权
    混合动力汽车的能源预约协调

    公开(公告)号:US09469289B2

    公开(公告)日:2016-10-18

    申请号:US14251706

    申请日:2014-04-14

    发明人: Hai Yu

    摘要: A hybrid vehicle includes a controller configured to, in response to an anticipated vehicle route for a current drive cycle including at least two preferred electric drive (“EV”) zones, control an engine to charge a battery in response to a battery SOC falling below various thresholds at various portions of the vehicle route. The controller controls the engine to charge the battery in response to the battery SOC falling below a first threshold and the vehicle not having entered the first EV zone, in response to the battery SOC falling below a second threshold and the vehicle having entered the first EV zone but not the second EV zone, and in response to the battery SOC falling below a third threshold and the vehicle having entered the second EV zone. The first threshold is greater than the second threshold, and the second threshold is greater than the third threshold.

    摘要翻译: 混合动力车辆包括控制器,其被配置为响应于包括至少两个优选电驱动(“EV”)区域的当前驱动循环的预期车辆路线,控制发动机响应于低于电池SOC的电池对电池充电 在车辆路线的各个部分的各种阈值。 响应于电池SOC低于第二阈值并且车辆进入第一EV,控制器响应于电池SOC低于第一阈值并且车辆未进入第一EV区域来控制引擎对电池充电 区域而不是第二EV区域,并且响应于电池SOC低于第三阈值并且车辆已经进入第二EV区域。 第一阈值大于第二阈值,第二阈值大于第三阈值。

    Polished semiconductor wafer and process for producing it
    13.
    发明授权
    Polished semiconductor wafer and process for producing it 有权
    抛光半导体晶圆及其生产工艺

    公开(公告)号:US07972963B2

    公开(公告)日:2011-07-05

    申请号:US11703458

    申请日:2007-10-11

    IPC分类号: H01L21/461

    摘要: A polished semiconductor wafer has a front surface and a back surface and an edge R, which is located at a distance of a radius from a center of the semiconductor wafer, forms a periphery of the semiconductor wafer and is part of a profiled boundary of the semiconductor wafer. The maximum deviation of the flatness of the back surface from an ideal plane in a range between R-6 mm and R-1 mm of the back surface is 0.7 μm or less. A process for producing the semiconductor wafer, comprises at least one treatment of the semiconductor wafer with a liquid etchant and at least one polishing of at least a front surface of the semiconductor wafer, the etchant flowing onto a boundary of the semiconductor wafer during the treatment, and the boundary of the semiconductor wafer which faces the flow of etchant being at least partially shielded from being struck directly by the etchant. The shielding extends in the direction of a thickness d of the semiconductor wafer and is at least d+100 μm long.

    摘要翻译: 抛光的半导体晶片具有前表面和后表面,并且位于距离半导体晶片的中心的半径的距离处的边缘R形成半导体晶片的周边,并且是边缘R的成型边界的一部分 半导体晶片。 在背面的R-6mm和R-1mm之间的范围内的背面与理想平面的平坦度的最大偏差为0.7μm以下。 一种用于制造半导体晶片的方法,包括用液体蚀刻剂对半导体晶片进行的至少一种处理以及半导体晶片的至少前表面的至少一次抛光,所述蚀刻剂在处理期间流到半导体晶片的边界上 并且面向蚀刻剂流动的半导体晶片的边界至少部分地被屏蔽而不被蚀刻剂直接攻击。 屏蔽沿半导体晶片的厚度d的方向延伸,并且长度至少为d +100μm。

    Active head restraint systems for vehicle seats
    14.
    发明授权
    Active head restraint systems for vehicle seats 有权
    汽车座椅主动头枕系统

    公开(公告)号:US07823971B2

    公开(公告)日:2010-11-02

    申请号:US12412689

    申请日:2009-03-27

    IPC分类号: B60N2/42 B60N2/427

    摘要: Multiple vehicle seats are disclosed with active head restraint systems that receive an input force from an occupant during an impact by a torso support, which consequently actuates a linkage that translates a head restraint upward and forward to the head of the occupant. In one embodiment, the torso support has a translatable connection with the seatback frame and another translatable connection with the linkage. In another embodiment, a torso support is pivotally connected to a pair of links which are each pivotally connected to the frame. In yet another embodiment, the seatback frame includes a structural wire, which provides pivotal connections for two of the links of the linkage.

    摘要翻译: 公开了多个车辆座椅,其具有主动的头枕系统,其在躯干支撑件的冲击期间接收来自乘员的输入力,从而致动将头枕向上和向前平移到乘员头部的连杆。 在一个实施例中,躯体支撑件具有与座椅靠背框架的可平移连接以及与连杆机构的另一可平移连接。 在另一个实施例中,躯体支撑件枢转地连接到一对链节,每对链节各自枢转地连接到框架。 在另一个实施例中,座椅靠背框架包括结构线,其提供连杆机构的两个连杆的枢转连接。