公开(公告)号：US20200006104A1

公开(公告)日：2020-01-02

申请号：US16435751

申请日：2019-06-10

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Bo Chen Chen ,  Sheng-Wei Wu ,  Yung-Li Tsai

IPC分类号： H01L21/67 ,  B08B5/02 ,  H01L21/677

摘要： The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.

公开(公告)号：US11766703B2

公开(公告)日：2023-09-26

申请号：US16532701

申请日：2019-08-06

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Bo Chen Chen ,  Sheng-Wei Wu ,  Yung-Li Tsai

IPC分类号： B08B7/04 ,  B08B1/00 ,  B08B1/02 ,  B08B3/04 ,  H01L21/67 ,  H01L21/02 ,  A46B13/02 ,  B08B1/04

CPC分类号： B08B7/04 ,  A46B13/023 ,  B08B1/002 ,  B08B1/02 ,  B08B3/041 ,  H01L21/02057 ,  H01L21/67046 ,  H01L21/67051 ,  B08B1/04

摘要： The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

公开(公告)号：US12020964B2

公开(公告)日：2024-06-25

申请号：US17700041

申请日：2022-03-21

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Bo Chen Chen ,  Sheng-Wei Wu ,  Yung-Li Tsai

IPC分类号： H01L21/67 ,  B08B5/02 ,  H01L21/677

CPC分类号： H01L21/67288 ,  B08B5/02 ,  H01L21/67739

摘要： The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.

公开(公告)号：US11958090B2

公开(公告)日：2024-04-16

申请号：US17875658

申请日：2022-07-28

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Bo Chen Chen ,  Sheng-Wei Wu ,  Yung-Li Tsai

IPC分类号： B08B7/04 ,  A46B13/02 ,  B08B1/00 ,  B08B1/02 ,  B08B1/04 ,  B08B3/04 ,  H01L21/02 ,  H01L21/67

CPC分类号： B08B7/04 ,  A46B13/023 ,  B08B1/002 ,  B08B1/02 ,  B08B3/041 ,  H01L21/02057 ,  H01L21/67046 ,  H01L21/67051 ,  B08B1/04

摘要： The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

公开(公告)号：US11282728B2

公开(公告)日：2022-03-22

申请号：US16435751

申请日：2019-06-10

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Bo Chen Chen ,  Sheng-Wei Wu ,  Yung-Li Tsai

IPC分类号： H01L21/67 ,  H01L21/677 ,  B08B5/02

摘要： The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.