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公开(公告)号：US20200024130A1
公开(公告)日：2020-01-23
申请号：US16042595
申请日：2018-07-23
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Nazila DADVAND , Kathryn SCHUCK
Abstract: A semiconductor package including a semiconductor die and at least one bondline positioned on the semiconductor die, the at least one bondline comprising a nickel lanthanide alloy diffusion barrier layer abutting a gold layer.
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