公开(公告)号：US20220399388A1

公开(公告)日：2022-12-15

申请号：US17491397

申请日：2021-09-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Bradley Andrew GLASSCOCK ,  Nagesh SURENDRANATH ,  Shriram DEVI

IPC: H01L27/146

Abstract: In examples, an electronic device comprises a semiconductor package including a semiconductor die and a set of conductive members coupled to the semiconductor die, the set of conductive members coupled to a bottom surface of the semiconductor package. The package also includes a conductive terminal coupled to the semiconductor die and exposed to the bottom surface, the set of conductive members extending farther away from the bottom surface of the semiconductor die than the conductive terminal extends from the bottom surface of the semiconductor die. The electronic device includes a flexible substrate having first and second ends opposing each other, the first end having a first conductive terminal coupled to the conductive terminal. The second end has a second conductive terminal adapted to be coupled to an electronic component, the first and second conductive terminals are coupled to each other, and the flexible substrate has a bottom surface that does not extend farther away from the bottom surface of the semiconductor package than the set of conductive members extends from the bottom surface of the semiconductor package.