公开(公告)号：US11616030B2

公开(公告)日：2023-03-28

申请号：US17539040

申请日：2021-11-30

Applicant: Southern University of Science and Technology

Inventor： Guobiao Zhang ,  Hongyu Yu ,  Shengming Zhou ,  Yuejin Guo ,  Kai Chen ,  Yida Li ,  Jun Lan

IPC: H01L23/64 ,  H01L21/48 ,  H01L21/683 ,  H01L23/538 ,  H01L49/02

Abstract: A method for making a three-dimensional (3-D) module includes the steps of: A) forming a laminate of alternate ceramic tape layers and internal electrode layers on a substrate; B) etching said laminate to form first and second capacitor stacks at said first and second locations; C) firing said first and second capacitor stacks integrally; D) forming first and second pairs of external electrodes on said first and second capacitor stacks, respectively.