公开(公告)号：US09116511B2

公开(公告)日：2015-08-25

申请号：US13278879

申请日：2011-10-21

申请人： Seung-Cheol Bang ,  Hyung Chul Lim ,  Jong Uk Park

发明人： Seung-Cheol Bang ,  Hyung Chul Lim ,  Jong Uk Park

IPC分类号： G04F10/00 ,  G04G3/04 ,  G04F10/04

CPC分类号： G04F10/005 ,  G04F10/00 ,  G04F10/04 ,  G04G3/04

摘要： The present invention makes it possible to measure a precision event time in such a way to make a reference data in accordance with a standard time reference frequency signal and to make a measurement data by using an apparatus with the same structure as a reference data with respect to a signal to be measured and to compare the measurement data with a reference data, whereby temperature effects can be minimized by making the time changes due to temperature changes occurring between two apparatuses happen equally, by providing the same structure and parts to a reference signal circuit apparatus for an event time measurement and a signal circuit apparatus to be measured, and the zero point adjustment is performed during the real time operation, so the system is not needed to stop.

摘要翻译： 本发明使得可以以这样的方式测量精确事件时间，以便根据标准时间参考频率信号作出参考数据，并且通过使用具有与参考数据相同结构的装置来制作测量数据， 与要测量的信号相比较，并将测量数据与参考数据进行比较，从而通过使两个装置之间发生的温度变化引起的时间变化可以使温度效应最小化，通过将相同的结构和部件提供给参考信号 用于事件时间测量的电路装置和待测量的信号电路装置，并且在实时操作期间执行零点调整，因此系统不需要停止。

公开(公告)号：US07462871B2

公开(公告)日：2008-12-09

申请号：US11497232

申请日：2006-08-02

申请人： Kyung Taeg Han ,  Myoung Soo Choi ,  Seon Goo Lee ,  Jong Uk Park ,  Chang Wook Kim

发明人： Kyung Taeg Han ,  Myoung Soo Choi ,  Seon Goo Lee ,  Jong Uk Park ,  Chang Wook Kim

IPC分类号： H01L27/15

CPC分类号： H01L25/167 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  Y10S257/918 ,  H01L2924/00014

摘要： In a side view LED, elongated first and second lead frames each have a finger extending therefrom. The finger of the first lead frame is disposed in parallel with that of the second lead frame. An LED chip and a protective device are mounted on mounting areas of the first and second lead frames, respectively and electrically connected to the first and second lead frames. A package body houses the first and second lead frames to form first and second opened areas. The first opened area is externally opened around the LED chip, the second opened area is externally opened around the protective device, and the partition wall is formed therebetween. First and second encapsulants are provided to the first and second opened areas, respectively to encapsulate the LED chip and protective device, respectively. At least the first encapsulant is transparent.

摘要翻译： 在侧视图LED中，细长的第一和第二引线框架各自具有从其延伸的指状物。 第一引线框架的指状物与第二引线框架的手指平行设置。 LED芯片和保护装置分别安装在第一和第二引线框架的安装区域上，并且电连接到第一引线框架和第二引线框架。 包装体容纳第一和第二引线框架以形成第一和第二开放区域。 第一开放区域围绕LED芯片外部打开，第二开放区域在保护装置周围被外部打开，并且间隔壁形成在其间。 第一和第二密封剂分别提供给第一和第二开放区域以分别封装LED芯片和保护装置。 至少第一密封剂是透明的。