PHOTOMASK ASSEMBLY AND SEMICONDUCTOR CHIP MANUFACTURED USING THE SAME

    公开(公告)号:US20250068050A1

    公开(公告)日:2025-02-27

    申请号:US18678622

    申请日:2024-05-30

    Abstract: A photomask assembly includes a mask pattern providing an upper surface and including a plurality of pins extending in a vertical direction with respect to the upper surface, a pellicle membrane disposed to be spaced apart from the mask pattern in the vertical direction, and a frame assembly configured to support the pellicle membrane, wherein the frame assembly includes a frame body having a plurality of pin holes configured to respectively fasten the plurality of pins, a first magnetic member configured to surround the plurality of pin holes inside the frame body and generate an attractive force on the plurality of pins, and a second magnetic member disposed in a lower portion of the frame body and configured to generate an attractive force on the upper surface of the mask pattern.

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