公开(公告)号：US20140212995A1

公开(公告)日：2014-07-31

申请号：US14145101

申请日：2013-12-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Bok YOON ,  Hae Yong EOM ,  Mi Hwa YOU ,  Seung Min HONG ,  Sang Hoon LEE ,  Yong Gu KIM

IPC: H01L21/66 ,  H01L27/15

CPC classification number: H01L22/26 ,  G01R31/2896 ,  H01L21/561 ,  H01L22/12 ,  H01L24/97 ,  H01L27/15 ,  H01L33/508 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A resin application apparatus includes: an optical property measurement unit measuring an optical property of light emitted from a light emitting diode (LED) chip which is mounted on a package body and to which transparent resin is not applied; and a resin application unit applying light conversion material-containing transparent resin to the LED chip in accordance with a resin application amount which is decided depending on the optical property measured by the optical measurement unit.

Abstract translation: 树脂施加装置包括：光学特性测量单元，测量从安装在封装体上并且不施加透明树脂的发光二极管（LED）芯片发射的光的光学特性; 以及树脂施加单元，其根据根据由光学测量单元测量的光学特性决定的树脂施加量，向LED芯片施加含有光转换材料的透明树脂。