公开(公告)号：US20160050473A1

公开(公告)日：2016-02-18

申请号：US14828858

申请日：2015-08-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woo-Chul LEE

IPC: H04R1/04

CPC classification number: H04R1/04 ,  H04R1/2811 ,  H04R2499/11

Abstract: An electronic device is provided. The electronic device includes a circuit board having a sound input hole penetrating through both surfaces of the circuit board, a microphone mounted on the circuit board, the microphone configured to receive a sound through the sound input hole, a first grounding pad surrounding the sound input hole on a surface of the circuit board, and a second grounding pad surrounding the first grounding pad on the surface of the circuit board. The microphone is mounted on the circuit board by soldering the microphone to the first and second grounding pads.

Abstract translation: 提供电子设备。 电子设备包括电路板，电路板具有穿过电路板的两个表面的声音输入孔，安装在电路板上的麦克风，配置成通过声音输入孔接收声音的麦克风，围绕声音输入的第一接地垫 电路板的表面上的第一接地焊盘，以及围绕电路板表面上的第一接地焊盘的第二接地焊盘。 麦克风通过将麦克风焊接到第一和第二接地垫来安装在电路板上。

公开(公告)号：US20150010192A1

公开(公告)日：2015-01-08

申请号：US14245350

申请日：2014-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woo-Chul LEE ,  Ju-Yong KIM ,  Eun-Su JEONG

IPC: H04R1/02

CPC classification number: H04R1/02 ,  H04R1/04 ,  H04R2499/11 ,  H04R2499/15

Abstract: An electronic device having a microphone device is provided. The electronic device includes at least one case frame which forms the external appearance of the electronic device, at least one microphone device which is disposed in the at least one case frame, and at least one microphone hole which is formed in a position corresponding to the at least one microphone device of the at least one case frame, and is disposed in a region which is not visually exposed in the at least one case frame.

Abstract translation: 提供具有麦克风装置的电子设备。 电子设备包括形成电子设备的外观的至少一个壳体框架，设置在至少一个壳体框架中的至少一个麦克风设备，以及形成在与所述至少一个壳体框架相对应的位置中的至少一个麦克风孔 所述至少一个壳体框架的至少一个麦克风装置，并且被布置在所述至少一个壳体框架中不被目视暴露的区域中。