公开(公告)号：US11955691B2

公开(公告)日：2024-04-09

申请号：US17702875

申请日：2022-03-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taekwan Cha ,  Yongwon Cho

IPC: H01Q1/22 ,  H01Q1/24 ,  H01Q1/48

CPC classification number: H01Q1/2266 ,  H01Q1/48

Abstract: An electronic device according to an embodiment of the disclosure may be configured to include a housing including a conductive plate and a non-conductive plate, a reinforcing member disposed at a first part inside the housing and including a groove of a predetermined length, a printed circuit board disposed at a second part different from the first part inside the housing, an antenna module disposed at one surface of the reinforcing member and including a ground layer at the rear surface thereof, and a signal connection member configured to electrically connect the printed circuit board and the antenna module, wherein a part of the signal connection member extends through the groove and is electrically connected to a first area of the ground layer in the groove by using a solder. Other various embodiments are possible.