公开(公告)号：US20230188888A1

公开(公告)日：2023-06-15

申请号：US18164057

申请日：2023-02-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngbae PARK ,  Changshik YOON ,  Kiwon KIM ,  Joohan KIM ,  Taeeon KIM ,  Jinju BAE ,  Incheol BAEK ,  Myungcheol LEE

IPC: H04R1/28 ,  H04R1/44

CPC classification number: H04R1/28 ,  H04R1/44 ,  H04R2499/11

Abstract: An electronic device includes a speaker module which includes a speaker unit and a first speaker housing that is coupled to the speaker unit in a first direction. The first speaker housing accommodates the speaker unit, and is arranged in the inner space of the electronic device. A soundproof device allows the inner space of the electronic device to communicate with the outside, and an acoustic passage connects the soundproof device and a portion from which a sound is radiated by the speaker unit of the speaker module. The speaker module can further include an airtight member for sealing a gap between the speaker module and the acoustic passage so that the sound radiated from the speaker unit is transmitted to the acoustic passage.