公开(公告)号：US20250143002A1

公开(公告)日：2025-05-01

申请号：US18647396

申请日：2024-04-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungsung CHU ,  In-Sang SONG

IPC: H01L27/146

Abstract: An image sensor module according to some example embodiments includes a reinforcement plate; a substrate on the reinforcement plate and defining a cavity; an image sensor chip in the cavity and configured to convert externally collected light to an electrical signal; an adhesive member along an upper edge of the image sensor chip; an optic filter on the adhesive member and defining an open region extending into a center of the optic filter, the optic filter covering an upper surface of the image sensor chip; and a bonding wire of which a first end is connected with the image sensor chip through the adhesive member and a second end is connected with the substrate.

公开(公告)号：US20240170510A1

公开(公告)日：2024-05-23

申请号：US18220394

申请日：2023-07-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In-Sang SONG ,  Kyungsung CHU

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14683

Abstract: An image sensor module having an image sensor chip configured to convert light collected from an outside into an electric signal, a substrate on which the image sensor chip is installed, a bonding wire electrically connecting the image sensor chip and the substrate, an encapsulant for encapsulating the bonding wire by surrounding the side part of the image sensor chip, and a housing having a lower part spaced apart from the encapsulant and bonded on the substrate, and an upper part having an opening through which an external light is incident to the image sensor chip and supported by the encapsulant.