公开(公告)号：US20230130025A1

公开(公告)日：2023-04-27

申请号：US17938338

申请日：2022-10-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Cha Won KOH ,  Tsunehiro NISHI ,  Ji Young PARK ,  Dong Il SHIN ,  Chang Soo WOO ,  Min Young LEE ,  Hyun Jae LEE

IPC: G03F7/029 ,  G03F7/039 ,  G03F7/004 ,  G03F7/20

Abstract: A photoresist composition including an organometallic compound, and a method for fabricating a semiconductor device using the same are provided. The photoresist composition may include an organometallic compound, a radical sensitizer including a structure of Chemical formula 2-1 or Chemical formula 2-2, and a solvent.
In Chemical formula 2-1, A1 is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, and R1, R2 and R3 are each independently hydrogen, a halogen, a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, or a hetero-functional group.
In Chemical formula 2-2, A2 is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, and R4 and R5 are each independently hydrogen, a halogen, a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, or a hetero-functional group.