公开(公告)号：US20220346277A1

公开(公告)日：2022-10-27

申请号：US17422612

申请日：2021-07-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngho YOON ,  Yonghyun PARK ,  Jungkeun LEE ,  Sangchul JUNG ,  Chunsik CHOI

IPC: H05K7/20 ,  G02B27/01

Abstract: A wearable electronic device according to various embodiments of the disclosure includes: a housing including a first housing part in which a processor is received and a second housing part in which a display is received, and a hinge connecting the first housing part and the second housing part and having a hole provided in an area in communication with an outside of the wearable electronic device. At least part of heat generated from the processor is radiated to the outside through the hinge having the hole formed therein.

公开(公告)号：US20220368145A1

公开(公告)日：2022-11-17

申请号：US17871306

申请日：2022-07-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongmin YOON ,  Seungnyun KIM ,  Jeongwon PARK ,  Chunsik CHOI

IPC: H02J7/00 ,  G06F3/01 ,  G02B27/01

Abstract: An electronic device may include a housing, a first interface, a second interface, a battery, a charger circuitry, and at least one processor. The at least one processor may determine information on a charging type of the external power supply connected through the first interface, acquire state information of the external electronic device connected through the second interface, acquire state information of the battery, determine a first power that will be supplied to the battery and a second power that will be supplied to the external electronic device, charge the battery based on the first power, and transmit the second power to the external electronic device through the second interface.

公开(公告)号：US20210059553A1

公开(公告)日：2021-03-04

申请号：US17011820

申请日：2020-09-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinchoul LEE ,  Minhyuk NAM ,  Yunguk LEE ,  Hyoungil SONG ,  Chunsik CHOI ,  Seungnyun KIM ,  Yongsang YUN

IPC: A61B5/0408 ,  A61B5/044 ,  A61B5/0432

Abstract: The electronic device includes a pad module and a main module. At least part of the patch module is attached to a user to obtain a bio-signal of the user. The pad module includes a first housing and a plurality of first electrodes disposed in the first housing. The main module is configured to record the bio-signal of the user that is transferred through the pad module. The main module includes a second housing that is coupled with the first housing in a first direction. The main module also includes a plurality of second electrodes disposed in the second housing. The plurality of second electrodes are configured to make electrical contact with the plurality of first electrodes. The main module further includes a plurality of magnetic bodies disposed in the second housing to correspond to positions of the plurality of second electrodes.

公开(公告)号：US20230059234A1

公开(公告)日：2023-02-23

申请号：US17980721

申请日：2022-11-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungkeun LEE ,  Chunsik CHOI ,  Yonghee JEUNG

IPC: G06F1/20 ,  G06F1/16 ,  G02B27/01

Abstract: According to an embodiment disclosed in the present document, an electronic device may include: a lens frame at least partially including a thermally conductive material; a pair of wearable members which can be rotatably coupled to the lens frame; at least one lens disposed in the lens frame; and transparent conductive lines disposed on the lens. The transparent conductive lines may be connected to the thermally conductive material of the lens frame to receive heat transferred from the lens frame. Other various embodiments are possible.

公开(公告)号：US20220210905A1

公开(公告)日：2022-06-30

申请号：US17572468

申请日：2022-01-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chunsik CHOI ,  Jeongwon PARK ,  Youngho YOON ,  Jongmin YOON ,  Jungkeun LEE ,  Sangchul JUNG

IPC: H05K1/02 ,  H05K1/14 ,  G02B27/01 ,  G02C11/00

Abstract: In an electronic device includes a heat dissipation structure. The heat dissipation structure may include: a first printed circuit board; a second printed circuit board spaced apart from the first printed circuit board to form a space; a first interposer and a second interposer together surrounding the space; at least one electronic component disposed in the space and mounted on the first printed circuit board; a first thermal interface material (TIM) combined with the electronic component; and a heat dissipation body attached to the TIM and transferring heat of the electronic component to an outside of the space.