公开(公告)号：US20240324132A1

公开(公告)日：2024-09-26

申请号：US18731991

申请日：2024-06-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoonhee LEE ,  Juncheol SHIN ,  Aeree KIM ,  Joungki PARK ,  Seungchang BAEK ,  Junghyun IM ,  Jinhwan JEONG ,  Sungho CHO ,  Hangyu HWANG

IPC: H05K5/04

CPC classification number: H05K5/04

Abstract: An electronic device housing and an electronic device including the same are provided. An electronic device housing includes a metal substrate, a plastic injection part formed on one area on a surface of the metal substrate, an oxide film layer formed on one area on the surface of the metal substrate, a plating layer formed on one area on the surface of the metal substrate, and a deposition layer formed on the plating layer, wherein the oxide film layer and the plating layer may be formed to be apart from each other.