Worktable for laser processing
    2.
    发明授权

    公开(公告)号:US12263543B2

    公开(公告)日:2025-04-01

    申请号:US17526470

    申请日:2021-11-15

    Abstract: A worktable for laser processing includes a lower plate, internal blocks, and external blocks. The lower plate includes a first area, a second area surrounding the first area, and a third area surrounding the second area. The internal blocks are disposed on the lower plate in the first area and the external blocks are disposed on the lower plate in the third area. The external blocks surround the internal blocks.

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