SUBSTRATE-TREATING APPARATUS AND METHOD FOR TREATING A SUBSTRATE USING THE SAME
    2.
    发明申请
    SUBSTRATE-TREATING APPARATUS AND METHOD FOR TREATING A SUBSTRATE USING THE SAME 审中-公开
    基板处理装置和使用该基板处理基板的方法

    公开(公告)号:US20160096201A1

    公开(公告)日:2016-04-07

    申请号:US14809028

    申请日:2015-07-24

    Abstract: A substrate-treating apparatus includes a liquid-providing part, a first liquid-removing knife and a returning part. The liquid-providing part provides a first liquid chemical for cleaning a substrate that includes a metal pattern and a photoresist pattern on the metal pattern, and for removing an etchant that remains on the substrate. The first liquid-removing knife sprays a second liquid chemical in a direction inclined and opposite to a returning direction of the substrate, so as to remove the first liquid chemical, the first liquid chemical including a metal precipitate. The returning part returns the substrate from the liquid-providing part toward the first liquid-removing knife in the returning direction.

    Abstract translation: 基板处理装置包括液体供给部,第一除液刀和​​返回部。 液体提供部分提供用于清洁在金属图案上包括金属图案和光刻胶图案的基板的第一液体化学品,以及用于去除残留在基板上的蚀刻剂。 第一除液刀沿与基板的返回方向倾斜并相反的方向喷射第二液体化学品,以除去第一液体化学品,第一液体化学品包括金属沉淀物。 返回部件使返回方向从液体供给部向第一除液刀返回基板。

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