公开(公告)号：US20140140093A1

公开(公告)日：2014-05-22

申请号：US14143604

申请日：2013-12-30

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： KYU-HUN LIM ,  TAE-SEOK JANG ,  JEONG-WEON SEO ,  YOON-HO KIM ,  YI-SOO WON ,  WON-JONG OHN

IPC: F21V8/00

CPC classification number: G02B6/0081 ,  G02B6/0035 ,  G02B6/005 ,  G02B6/0053 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0085 ,  G02F2001/133628

Abstract: A backlight assembly includes a light guiding plate, a light source and a bottom receiving plate. The light source is disposed at a first side of the light guiding plate. The bottom receiving plate includes a bottom surface and a side wall to form a receiving space in which at least a portion of the light guiding plate is placed. The bottom surface is smaller than a lower surface of the light guiding plate and has a plurality of openings formed through the bottom surface. The side wall extends from the bottom surface.

Abstract translation: 背光组件包括导光板，光源和底部接收板。 光源设置在导光板的第一侧。 底部容纳板包括底面和侧壁，以形成至少一部分导光板的容纳空间。 底表面小于导光板的下表面，并且具有通过底表面形成的多个开口。 侧壁从底面延伸。

公开(公告)号：US20230220280A1

公开(公告)日：2023-07-13

申请号：US18122706

申请日：2023-03-17

Applicant: Samsung Display Co., Ltd.

Inventor： JONGHEE PARK ,  HYOUNG SIK KIM ,  O Byoung Kwon ,  Gi-Yong Nam ,  Kyungchan Min ,  SUCK JUN LEE ,  YOUNGMIN KIM ,  JINHYUNG KIM ,  DONGHUN LEE ,  KYU-HUN LIM ,  DONGMIN JANG

IPC: H10K71/00 ,  C09K13/06 ,  H10K59/12

CPC classification number: H10K71/621 ,  C09K13/06 ,  H10K59/1201

Abstract: An etching composition for a silver-containing thin film, the etching composition comprising an inorganic acid compound, a sulfonic acid compound, an organic acid compound, a nitrate, a metal oxidizing agent, an amino acid compound, and water.

公开(公告)号：US20220204846A1

公开(公告)日：2022-06-30

申请号：US17388712

申请日：2021-07-29

Applicant: Samsung Display Co., Ltd.

Inventor： JONGHEE PARK ,  HYOUNG SIK KIM ,  O Byoung Kwon ,  Gi-Yong Nam ,  Kyungchan Min ,  SUCK JUN LEE ,  YOUNGMIN KIM ,  JINHYUNG KIM ,  DONGHUN LEE ,  KYU-HUN LIM ,  DONGMIN JANG

IPC: C09K13/06 ,  C23F1/44 ,  C23F1/02 ,  H01L51/00

Abstract: An etching composition for a silver-containing thin film, the etching composition comprising an inorganic acid compound, a sulfonic acid compound, an organic acid compound, a nitrate, a metal oxidizing agent, an amino acid compound, and water.