BONDING STRUCTURE AND DISPLAY DEVICE HAVING THE SAME

    公开(公告)号:US20230329054A1

    公开(公告)日:2023-10-12

    申请号:US18296019

    申请日:2023-04-05

    CPC classification number: H10K59/131 H10K59/90

    Abstract: A display device includes a display module including a pad region, a base layer in which a first open region corresponding to the pad region is defined, a pixel on the base layer, and a signal line which is on the base layer, electrically connected to the pixel and includes a pad portion corresponding to the first open region, a flexible circuit board electrically connected to the display module, at the pad region of the display module, a window facing the display module, an upper layer between the window and the display module, and a resin structure which bonds the flexible circuit board to the display module, at the pad region.

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