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公开(公告)号:US20240414956A1
公开(公告)日:2024-12-12
申请号:US18398197
申请日:2023-12-28
Applicant: Samsung Display Co., Ltd.
Inventor: Jae Hyun LEE , Seung Ha CHOI , Ye Eun KANG , Jong Bum CHOI , Seung Rae KIM , Woo Geun LEE
IPC: H10K59/123 , G09G3/32
Abstract: A display device includes a first pixel and a second pixel. The first pixel and the second pixel each includes a first transistor, a portion of a via layer disposed on the first transistor, and a portion of a first metal layer disposed on the via layer. The first pixel and the second pixel further include a first pixel electrode and a second pixel electrode disposed in the first metal layer, and a first end of the first pixel electrode faces the second pixel electrode and is positioned at a height lower than the second pixel electrode.
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公开(公告)号:US20230413632A1
公开(公告)日:2023-12-21
申请号:US18118886
申请日:2023-03-08
Applicant: Samsung Display Co., LTD.
Inventor: Hyun KIM , Ye Eun KANG , Dong Hyun WON , Kwang Soo LEE , Seung Ha CHOI
IPC: H10K59/131 , H10K59/12
CPC classification number: H10K59/1315 , H10K59/1201
Abstract: A display device includes a first conducive layer including a first and second wiring, a semiconductor layer on the first conductive layer and including a first to third semiconductor part, a gate insulating layer on the semiconductor layer, and a second conductive layer on the gate insulating layer and including a gate electrode overlapping the first semiconductor part, a first connecting electrode overlapping the second semiconductor part, and a second connecting electrode overlapping the third semiconductor part. The first and second connecting electrodes are directly connected to the second and third semiconductor parts, respectively. The second and third semiconductor parts include semiconductor openings. The first connecting electrode includes a (1-1)-th and (1-2)-th connecting electrodes. A width of the (1-2)-th connecting electrodes is less than a width of the (1-1)-th connecting electrode, and the (1-2)-th connecting electrodes protrude from the (1-1)-th connecting electrode toward the semiconductor openings.
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