Test handler apparatus for SMD (surface mount devices), BGA (ball grid arrays) and CSP (chip scale packages)
    1.
    发明申请
    Test handler apparatus for SMD (surface mount devices), BGA (ball grid arrays) and CSP (chip scale packages) 有权
    SMD(表面贴装器件),BGA(球栅阵列)和CSP(芯片级封装)的测试处理设备

    公开(公告)号:US20030020457A1

    公开(公告)日:2003-01-30

    申请号:US10188284

    申请日:2002-07-01

    CPC classification number: G01R31/2887

    Abstract: A test handler apparatus, having a treatment area; a testing station in the treatment area; and an output unit connected to an output of the treatment area. An input unit picks singulated or stripped packages and unloads them on carrier boats in a loading zone; a conveyor mechanism transfers the carrier boats from the loading zone through the treatment area to the testing station and from the testing station to the output unit. In practice, the carrier boat forms a universal carrier which is able to contain multiple singulated or strip packages for the purpose of testing. Placing packages onto carriers with standardized dimension allows handler equipment to accommodate the packages in singulated or strip condition.

    Abstract translation: 具有处理区域的测试处理装置; 治疗区内的检测站; 以及连接到处理区域的输出的输出单元。 输入单元选择单个或剥离的包装,并在装载区域的载体船上卸载它们; 输送机构将承载船从装载区域通过处理区域传送到测试站,并从测试站传送到输出单元。 在实践中,承载船形成通用载体,其能够包含用于测试目的的多个单个或带状包装。 将包装放置在具有标准尺寸的载体上,使处理设备能够在单独或剥离条件下容纳包装。

Patent Agency Ranking