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公开(公告)号：US10043733B1
公开(公告)日：2018-08-07
申请号：US13844179
申请日：2013-03-15
Applicant: STATS ChipPAC Pte. Ltd.
Inventor： Reza Argenty Pagaila , Byung Tai Do , Linda Pei Ee Chua
IPC: H01L23/00 , H01L23/488
Abstract: A method of manufacture of an integrated circuit packaging system includes providing an integrated circuit having an active side and a non-active side; forming an indent, having a flange and an indent side, from a peripheral region of the active side; and forming a conformal interconnect, having an elevated segment, a slope segment, and a flange segment, over the indent.
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