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公开(公告)号：US20240276695A1
公开(公告)日：2024-08-15
申请号：US18681861
申请日：2021-08-13
申请人： SHINKAWA LTD.
发明人： Shinichi YOSHIDA
IPC分类号： H05K13/08 , B23K1/20 , B23K101/36 , H05K13/04
CPC分类号： H05K13/0812 , B23K1/203 , H05K13/0465 , B23K2101/36
摘要： A flux transfer apparatus (1) includes: a transfer stage (21), storing a flux; a holding tool (13), holding an electronic component (CP) by using a holding surface (13a), so that an electrode formation surface (CPA) of the electronic component (CP) is immersed into the flux stored in a transfer stage (21); an image capturing part (31), obtaining a captured image of at least one of the electrode formation surface (CPA) of the electronic component (CP) after flux transfer and the transfer stage (21) after flux transfer; and a detection part (51), detecting an inclination of the holding surface (13a) with respect to the transfer stage (21) based on the captured image.
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公开(公告)号：US20230392921A1
公开(公告)日：2023-12-07
申请号：US18032564
申请日：2020-10-19
申请人： SHINKAWA LTD.
发明人： Shinichi YOSHIDA
CPC分类号： G01B11/0608 , H05K13/046 , G01B11/24
摘要： The present invention can provide a measurement device, a measurement method, and a bonding system, which enable estimation of the state of the underside of an electronic component mounted on a substrate. A measurement device performs measurements on an electronic component that is mounted on a main surface of a substrate, the measurement device comprising: a measurement part that measures a component height position, which is the height of the upper surface of the electronic component, and a substrate height position, which is the height of a non-mount region of the main surface of the substrate where the electronic component is not mounted; and an estimation part that estimates position information relating to a mount region of the main surface of the substrate where the electronic component is mounted, on the basis of the component height position and the substrate height position as measured by the measurement part.
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